AER21-21-18CB/A01

Thermal - Heat Sinks provide essential functions for electrical and electronic components. The AER21-21-18CB/A01 is an example of a thermal management solution that effectively dissipates heat built up from applications ranging from consumer electronics to industrial machinery.

AER21-21-18CB/A01 is a heat sink designed to effectively dissipate heat generated by high-power components such as CPUs and GPUs. The heat sink uses a combination of both natural and forced-air convection techniques to achieve this. It features a copper base for rapid heat transfer and reduce hot spots, multiple fin stacks to increase the surface area for better heat dissipation, and a fan to provide forced convection and reduce fan noise. The heat sink also includes a thermal adhesive backing to secure it to the component.

In operation, the heat sink\'s copper base absorbs heat generated by the component. The multiple fin stacks increase the surface area of the heat sink, allowing for more efficient heat dissipation. The fan then receives the hot air from the fin stacks and drives it away from the component, resulting in a decrease in temperature. The thermal adhesive backing secures the heat sink to the component, preventing it from slipping off or moving.

The AER21-21-18CB/A01 is an effective heat sink for components such as CPUs and GPUs, making it suitable for a variety of applications. It has a maximum airflow of 120 CFM, supporting high-power components. Its low noise fan ensures quiet operation, making it suitable for environments where noise levels are a concern. Additionally, its ultra-low thermal resistance ensures rapid heat transfer, which prevents performance degradation in higher power components.

In conclusion, the AER21-21-18CB/A01 is a reliable thermal management solution for components such as CPUs and GPUs. It features a copper base for rapid heat transfer, multiple fin stacks to increase the surface area for better heat dissipation, and a fan for forced convection. Its low noise fan and thermal adhesive backing make it suitable for a variety of applications, while its maximum airflow and thermal resistance ensure effective and efficient operation. The AER21-21-18CB/A01 is a reliable and cost-effective thermal management solution.