AER27-27-28CB/A01 Allicdata Electronics
Allicdata Part #:

AER27-27-28CB/A01-ND

Manufacturer Part#:

AER27-27-28CB/A01

Price: $ 4.60
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER27-27-28CB/A01 datasheetAER27-27-28CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 4.13954
Stock 1000Can Ship Immediately
$ 4.6
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 1.047" (26.60mm)
Width: 1.047" (26.60mm)
Diameter: --
Height Off Base (Height of Fin): 1.087" (27.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.82°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.17°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The AER27-27-28CB/A01 is an order of thermoelectric cooling device which is part of the Thermal - Heat Sinks family and is used in numerous applications. It is an essential component for any environment that requires thermal management to keep a device\'s temperature within a designated range to maintain optimal performance and reliability.

The main idea behind this device is that it utilizes the Peltier effect to transfer heat. The Peltier effect relies on two junctions of a semiconductor material to create a thermal joint. When voltage is passed through the chip, heat is transferred from one side of the joint to the other, cooling or heating depending on the direction of the electric current.

The AER27-27-28CB/A01 is a single stage thermoelectric cooling device that employs a vertically stacked array of Peltier elements with a total of 28 elements. Each element consists of two sides, one side is heated and the other side is cooled. This type of device is well suited for high power densities due to its excellent heat transfer capabilities. Its high capacity enables it to handle high levels of heat loads and provides the user with a more consistent performance.

The AER27-27-28CB/A01 can be used in a variety of different applications where cooling is necessary. One of the most popular applications for this device is in data centers, where servers and other components must be kept at precise temperatures to ensure proper performance. Additionally, this device has also been used to cool laser diodes which generate significant amounts of heat, as well as in remote sensing equipment to cool components and keep systems running more efficiently. This device is also widely used in medical and laboratory applications due to its high capacity and precision cooling.

In conclusion, the AER27-27-28CB/A01 is an essential component for any Thermal - Heat Sinks setup that requires thermal management. Its ability to efficiently transfer heat and its high capacity makes it an ideal choice for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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