AER21-21-28CB/A01 Allicdata Electronics
Allicdata Part #:

AER21-21-28CB/A01-ND

Manufacturer Part#:

AER21-21-28CB/A01

Price: $ 3.92
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER21-21-28CB/A01 datasheetAER21-21-28CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.55679
Stock 1000Can Ship Immediately
$ 3.92
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 0.811" (20.60mm)
Width: 0.811" (20.60mm)
Diameter: --
Height Off Base (Height of Fin): 1.087" (27.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.72°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.50°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical element of any modern electronic system, and heat sinks are an essential component for efficient heat transfer. The AER21-21-28CB/A01 is a thermal management solution designed for applications with high power and complex cooling requirements. It provides good thermal performance in an economical package, making it an ideal choice for a variety of applications.

The AER21-21-28CB/A01 is an efficient heat transfer component that uses a form factor for a wide variety of applications. The device is a finned heat sink made of high-grade aluminum, which provides excellent thermal performance in a very compact package. It uses a variety of cooling technologies, including fin geometry and heat spreading for improved heat transfer efficiency, and its advanced design features allow for quick and easy assembly and maintenance.

The AER21-21-28CB/A01 is designed to be used in applications that require high-power cooling with thermal solutions that have a higher amount of airflow, such as laptops, servers, and desktop computers. The device has high-grade aluminum fins that allow for efficient thermal transfer from the hot location to the cooler region. The device is also designed to be lightweight and portable, making it suitable for use in a variety of systems.

The device uses a combination of technology to achieve efficient thermal transfer. One of the most important elements of the AER21-21-28CB/A01 is the fin geometry, which helps to create a highly efficient heat spreading system. The fins are designed in a pattern that allows for maximum surface area and heat transfer, while also reducing air friction and providing low air resistance. The fins are also designed with a low profile to provide efficient airflow to the hot compact areas within the system.

In addition to the fin geometry, the AER21-21-28CB/A01 uses a combination of convection and conduction to optimize heat transfer. Convection is used to transfer the heat away from the components while conduction is used for transferring the heat to other external components. This helps to reduce the amount of energy required to cool the system and increases the efficiency of the cooling system as a whole.

The AER21-21-28CB/A01 is designed for use in high-performance cooling applications and is an ideal choice for any system requiring efficient thermal transfer. With its lightweight design and advanced technology, it is an economical solution that delivers superior thermal performance in a compact package. This makes the AER21-21-28CB/A01 a perfect match for applications that require high power and complex cooling requirements.

The specific data is subject to PDF, and the above content is for reference

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