AER25-25-12CB/A01

Series:	AER
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Fins
Length:	0.969" (24.61mm)
Width:	0.969" (24.61mm)
Diameter:	--
Height Off Base (Height of Fin):	0.457" (11.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.42°C/W @ 200 LFM
Thermal Resistance @ Natural:	13.38°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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AER25-25-12CB/A01 Thermal - Heat Sink Application and Working Principle

AER25-25-12CB/A01 thermal - heat sink is a thermal device utilized to expedite the dissipation of heat from electrical components and equipment. The highly efficient and effective thermal management involving this device will prolong the component life and promote reliable operations. In this paper, we will discuss the application and the working principle of the AER25-25-12CB/A01 thermal - heat sink.

Application

AER25-25-12CB/A01 thermal - heat sink is mainly used in motor control cabinets and power supplies because of its excellent thermal conductivity. Its wide range of motor control cabinets and power supply applications includes DRV11-3160 aero-space motor control module, power amplifiers, and brushless DC motors. AER25-25-12CB/A01 thermal - heat sink also can be used to dissipate the heat generated by a variety of IC components such as integrated circuits and semiconductor devices. The small size of the AER25-25-12CB/A01 heat sink makes it an ideal fit for small, space-restricted applications.

Working Principle

AER25-25-12CB/A01 thermal – heat sink comprises of an interconnected web of thin aluminum fins, whose purpose is to dissipate heat. The fins are then connected to a steel frame which increases both the strength and reliability of the device. The main heat dissipation mechanism of the AER25-25-12CB/A01 thermal – heat sink is by convection and conduction. Convection is the most common of the two. It basically works by transferring the heat away from the internal electronics to the surrounding environment through convective air flow. This works because as the heat from the electronics is conducted to the fins, the air molecules around the fins also get heated up. This hot air then moves away from the heat sink along with the heat it carries. The other heat dissipation mechanism of the AER25-25-12CB/A01 thermal – heat sink is conduction. This works when the heat from the internal electronics is conducted directly to the metal fins. The heat then dissipates to the environment through the metal fins by a continuous non-energetic transfer. The AER25-25-12CB/A01 thermal - heat sink also features a number of other components to increase both its thermal performance and reliability. These components include thermally conductive paste, a heat spreader, and a copper baseplate. The thermally conductive paste helps to improve the thermal interface between the internal electronics and the heat sink while the heat spreader helps to improve the surface area creating a more uniform heat dissipation. The copper baseplate, meanwhile, helps to keep the heat sink from warping.

Conclusion

The AER25-25-12CB/A01 thermal - heat sink is a widely used device for motor control cabinets and power supplies, as well as a variety of other applications. It has two main heat dissipation mechanisms, namely convection and conduction, that help to move the heat away from the internal electronics and toward the environment. The AER25-25-12CB/A01 also features a host of other components designed to improve its thermal performance. With so many beneficial features, the AER25-25-12CB/A01 thermal - heat sink is an ideal device for thermal management in a wide range of applications.

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