APR21-21-18CB/A01 Allicdata Electronics
Allicdata Part #:

APR21-21-18CB/A01-ND

Manufacturer Part#:

APR21-21-18CB/A01

Price: $ 3.63
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR21-21-18CB/A01 datasheetAPR21-21-18CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.29452
Stock 1000Can Ship Immediately
$ 3.63
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 0.811" (20.60mm)
Width: 0.811" (20.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.693" (17.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.74°C/W @ 200 LFM
Thermal Resistance @ Natural: 14.17°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

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Thermal - Heat Sinks

The APR21-21-18CB/A01 heat sink is an essential component for the effective performance of modern computing and electronic systems. The heat sink, available in both single and double-sided configurations, is designed to optimize and maintain thermal performance in a range of conditions. It has a unique, highly conductive construction that allows it to effectively dissipate heat and keep components in a proper operating temperature without relying on fans or active air cooling.

Design Overview

The APR21-21-18CB/A01 replaces traditional aluminum heat sinks with a design that uses high conductivity thin copper ribbons as the primary heat transfer material. This design gives the heat sink several advantages over aluminum alternatives including higher thermal performance and lower weight. The thin copper ribbons, also called laminar heat fins, are bonded to aluminum blocks on both sides of the heat sink to form a highly efficient heat transfer surface.

Performance & Sizing

The laminar heat fin construction of the APR21-21-18CB/A01 allows it to provide some of the highest thermal performance available in a heat sink, with low levels of airflow resistance. Its height is adjustable for a range of thermal loads, making it suitable for a variety of cooling applications. The size of the heat sink should match the cooling requirements of the component or system it is intended to cool.

Installation

The APR21-21-18CB/A01 heat sink can be easily installed with minimal effort. It can be mounted onto a wide variety of substrates with either mechanical (screws, clips, etc.) or adhesive mounting methods. Once the heat sink is in place, the integrated laminar heat fins provide a high degree of contact with the component or system it is cooling. The contact surface should be cleaned before installation to ensure maximum thermal performance.

Conclusion

The APR21-21-18CB/A01 Heat Sink is a state-of-the-art thermal solution designed to provide reliable cooling for modern electronic components and systems. Its unique design combines a highly conductive laminar heat fin construction with an adjustable height profile that supports a range of cooling requirements. The heat sink can be easily installed with both mechanical and adhesive mounting methods for maximum convenience. The APR21-21-18CB/A01 heat sink is a top choice for high-performance, reliable thermal performance.

The specific data is subject to PDF, and the above content is for reference

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