APR27-27-12CB/S Allicdata Electronics
Allicdata Part #:

294-1127-ND

Manufacturer Part#:

APR27-27-12CB/S

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED WITH SMALL CLIP
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR27-27-12CB/S datasheetAPR27-27-12CB/S Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Clip
Shape: Square, Pin Fins
Length: 1.047" (26.60mm)
Width: 1.047" (26.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

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Thermal - Heat Sinks

APR27-27-12CB/S is a high performance heat sink, developed for thermal dissipation in electronic systems that require high power or high temperature. Heat sinks are commonly used in high-end CPUs, GPUs and other power cores to ensure proper cooling and prevent damaging thermal runaway. The APR27-27-12CB/S thermal heat sink is constructed from anodized aluminum, featuring a ventilated fin design for maximum surface area and effectively dispersing the heat away from critical components. It also features a high airflow shroud that allows air to flow almost unobstructed to the fins for better heat transfer. Additionally, the design of the heat sink includes an integrated fan bracket to hold an additional fan (or fans) for improved cooling efficiency. As far as the working principle is concerned, the heat sink works under the same fundamental laws of thermodynamics as other cooling devices. Heat generated by the components is dissipated to the heatsink that, in turn, dissipates the heat through the fins to the surrounding air. The airflow over the fins then displaces the air containing the heated particles away from the components, cooling them in the process. In order to make sure the heat sink works effectively, it is important to use proper thermal paste and ensure all components are tightly mounted on the heat sink. The thermal paste helps to improve the thermal efficiency by making a better connection between the processor heat spreader and the heat sink base. Performance will also be affected by the air pressure and flow through the heatsink.The APR27-27-12CB/S is a highly effective and efficient solution for any application requiring a reliable, safe, and durable thermal solution. With its robust metal construction, high performance fin design, and integrated fan bracket, it can provide reliable and efficient heat dissipation in the most demanding of thermal power applications.

The specific data is subject to PDF, and the above content is for reference

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