APR23-23-23CB/A01 Allicdata Electronics
Allicdata Part #:

APR23-23-23CB/A01-ND

Manufacturer Part#:

APR23-23-23CB/A01

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR23-23-23CB/A01 datasheetAPR23-23-23CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.81503
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 0.890" (22.61mm)
Width: 0.890" (22.61mm)
Diameter: --
Height Off Base (Height of Fin): 0.890" (22.61mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.62°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.81°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The thermal-heat sinks APR23-23-23CB/A01 is an integral component used in various applications to dissipate heat away from components or systems. Thermal heat sinks are found in a wide variety of products including air conditioners, microwaves, computers, and mobile phones. The function of a thermal-heat sink is to transfer heat away from delicate components and cool it to a safe level. This is done by providing large surface area, usually made up of aluminum or copper materials, which the heat can be dissipated through faster.

The APR23-23-23CB/A01 is designed specifically to provide high performance cooling for the electronics it is installed in. It features an anodized aluminum heatsink body, which provides strong resistance to corrosion and increased durability. The heatsink is designed to be mounted directly onto the printed circuit board in order to provide more efficient heat transfer away from the component it is cooling. The body of the APR23-23-23CB/A01 is also designed with cooling fins which increase the available surface area and allow heat to dissipate more quickly.

The thermal performance of the APR23-23-23CB/A01 is achieved thanks to its advanced thermal design. The design includes an optimized thermal fin profile, which allows for increased surface area and improved heat transfer capabilities. The advanced design also allows for improved airflow around the fins and helps to conduct heat away from components much quicker. This helps to reduce the temperature in the surrounding environment and allows for more efficient cooling.

The APR23-23-23CB/A01 also includes anti-vibration compatibility, which helps to reduce the amount of noise generated when operating at higher temperatures. This helps to create a more pleasant working environment and is especially beneficial in installations where noise control is a priority. The anti-vibration compatibility also helps to provide a longer operating life for the heatsink, as it is better able to handle shock, vibration, and other environmental effects.

The APR23-23-23CB/A01 is designed to provide cooling for a range of different applications. It is most commonly used in consumer electronics such as video cards, graphics cards, processors, and TVs. It is also used in industrial and automotive applications to help keep sensitive components cool and protect them from damage due to heat. The APR23-23-23CB/A01 is a great choice for applications where thermal performance and reliability are of paramount importance.

In conclusion, the APR23-23-23CB/A01 is a reliable and efficient thermal-heat sink solution for a wide range of applications. It features an optimized fin profile and provides excellent thermal performance. It has anti-vibration compatibility, which helps to reduce noise and improve the lifespan of the heatsink. The APR23-23-23CB/A01 is designed to provide reliable cooling for the most demanding of applications.

The specific data is subject to PDF, and the above content is for reference

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