APR21-21-23CB/A01

Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	0.811" (20.60mm)
Width:	0.811" (20.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.890" (22.61mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.10°C/W @ 200 LFM
Thermal Resistance @ Natural:	13.47°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Overview

Thermal - Heat Sinks are a type of cooling device used to prevent overheating of the electronics in computer systems. The APR21-21-23CB/A01 is a particular heat sink that is designed to be used in applications that require high-efficiency cooling, such as medical and industrial equipment. In this article, we will discuss the application field and working principle of the APR21-21-23CB/A01 Heat Sinks.

Application Fields

The APR21-21-23CB/A01 Heat Sinks are designed for use in applications where high-efficiency cooling is required, such as medical and industrial equipment. This particular heat sink has been designed to meet the demands of these specific applications, as it offers high thermal efficiency and a slim form factor. It has a wide range of features that make it suitable for these types of applications, such as its superior thermal performance, its slim body, and its compatibility with a wide range of components. The APR21-21-23CB/A01 is also compatible with various mounting options, such as wall-mounting, and stand-alone.

Working Principle

The APR21-21-23CB/A01 Heat Sink works on the principle of thermal conduction. It employs a simple but effective design that effectively transfers heat from the component it is attached to, to the surrounding environment. The heat sink has a large number of fins that are arranged in a specific configuration to allow for large areas of contact between the heatsink and the component it is attached to. This configuration ensures that heat is quickly and effectively conducted from the component to the heat sink, where it is then dissipated into the surrounding environment.The effectiveness of the thermal conduction process of the APR21-21-23CB/A01 Heat Sink is due to its unique design. The heat sink has been designed to maximize heat transfer efficiency. It has an optimized fin arrangement that allows for an increased surface area of contact between the heat sink and the component, which allows for more efficient heat conduction. Additionally, the heat sink has a copper base that provides better thermal conductivity, allowing for a faster heat transfer rate. The APR21-21-23CB/A01 Heat Sink also has several other features which make it suitable for high-efficiency cooling applications. The heat sink is designed to be low profile and has a slim design which allows it to fit into tight spaces. It also has a secure mounting system, which ensures that it is securely attached and won\'t come loose during operation. Additionally, the heat sink has an anodized aluminum surface which provides superior corrosion resistance.In addition to its superior thermal conductivity, the APR21-21-23CB/A01 is an effective cooling device because of its unique design. It features multiple fins arranged in a specific configuration which allows for maximum effective heat transfer. This arrangement also minimizes the turbulence of air flow and maximizes the contact between the heat sink and the component, allowing for effective and efficient cooling.

Conclusion

The APR21-21-23CB/A01 Heat Sink is a high-efficiency cooling device specially designed for medical and industrial applications. It has superior thermal efficiency, a slim body, and superior corrosion resistance, which make it ideal for these types of applications. The heat sink has a copper base which provides better thermal conductivity, and its multiple fins are arranged in a unique configuration to maximize heat transfer. This device is also low profile and has a secure mounting system to ensure it is securely attached. The APR21-21-23CB/A01 is an ideal solution for any application where high efficiency cooling is required.

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