APR21-21-33CB/A01 Datasheet/PDFThermal - Heat Sinks: APR21-21-33CB/A01 Application Field and Working Principle
APR21-21-33CB/A01 is a type of heat sink developed by Avago Technologies. Heat sinks are used in a wide range of applications, including computers, electronics, and lasers. APR21-21-33CB/A01, in particular, is designed to absorb and dissipate thermal energy from an electrical component. It utilizes a combination of framed heat pipes and aluminum fins in order to efficiently conduct heat away from the component.
In order to understand the application field and working principle of APR21-21-33CB/A01, it is important to first understand the general principles of heat sinks. Heat sinks are used to dissipate thermal energy from a given component through the process of convection, which occurs when heated air rises away from the component and cool air takes its place. Heat can then be transferred away from the component by either vented air, a fan, or a heat pipe. Heat pipes are particularly efficient as they use the natural properties of liquid to draw heat away from the component. With the APR21-21-33CB/A01, this is done through a combination of sealed aluminum tubes filled with a liquid coolant, which transfers heat away from the component into an array of aluminum fins.
The application field of APR21-21-33CB/A01 is broad, and includes high-power electronics, LEDs, and many other types of components. In particular, it is an ideal solution for high-powered LED apps where high levels of thermal resistance are required. The heat pipes transfer the heat away from the component and dissipate it through the aluminum fins, which together provide a low resistance and high transfer rate. For this reason, the APR21-21-33CB/A01 is ideal for providing a thermal solution for a wide array of components, such as CPUs, GPUs, and many other integrated circuits.
In terms of its working principle, the APR21-21-33CB/A01 utilizes a combination of framed heat pipes and aluminum fins that work together to transfer and dissipate heat away from the component. The heat pipes are filled with a liquid coolant and are sealed off in order to maintain the integrity of the system. When thermal energy is generated by the component, it is absorbed into the heat pipes and then transferred into the array of aluminum fins. The fins are designed to have a large surface area in order to maximize the dissipation of heat. Once the heat is transferred into the aluminum fins, it is expelled into the surrounding air via convection.
Overall, APR21-21-33CB/A01 is an efficient heat sink solution that provides high levels of thermal resistance and quick heat transfer. The framed heat pipes and aluminum fins work together to quickly absorb electronic heats and dissipate them out of the system. As such, APR21-21-33CB/A01 is an ideal thermal solution for a wide range of components, from CPUs to LEDs.