APR27-27-12CB Allicdata Electronics
Allicdata Part #:

294-1125-ND

Manufacturer Part#:

APR27-27-12CB

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED 27 X 27 X 12MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR27-27-12CB datasheetAPR27-27-12CB Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Pin Fins
Length: 1.047" (26.60mm)
Width: 1.047" (26.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The APR27-27-12CB is an integral part of the thermal-heat sink market, and is highly valued as a thermal management solution.

Thermal-heat sink technology works by allowing heat generated from equipment to be dissipated away from sensitive components. It does so by providing a pathway of finite resistance through which heat can be conducted. In many cases, this heat can be quickly and efficiently dissipated away from vital components.

The APR27-27-12CB is specifically designed to perform this thermal-heat sink function. This device uses a combination of high quality heat-conductive materials, such as aluminum, in order to efficiently dissipate heat away from highly sensitive components. By using several fins, the APR27-27-12CB creates an effective heat sink construction that quickly dissipates any generated heat.

The APR27-27-12CB is also designed to easily accommodate most thermal dissipative needs. It can be easily mounted to the desired device, and can even be adjusted for optimum performance. The device also features a thermally conductive adhesive, making it easy to mount the APR27-27-12CB to the desired appliance.

In summary, the APR27-27-12CB is a highly reliable solution for thermal-heat sink applications. Its aluminum construction ensures excellent performance, and its mounting construction makes it easy to use with any device. The device’s thermally conductive adhesive makes it easy to mount, while its adjustable construction ensures an optimized performance.

The specific data is subject to PDF, and the above content is for reference

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