Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	0.890" (22.61mm)
Width:	0.890" (22.61mm)
Diameter:	--
Height Off Base (Height of Fin):	0.575" (14.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.62°C/W @ 200 LFM
Thermal Resistance @ Natural:	13.93°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Thermal - Heat Sinks

APR23-23-15CB/A01 Application Field and Working Principle

Heat sinks are an essential component of many modern electronic devices. These devices often generate significant amounts of heat during operation, which can cause damage to sensitive components if left unchecked. A heat sink is an electronic device designed to transfer heat away from components and dissipate it into the surrounding environment. Heat sinks are commonly used to protect and prolong the life of delicate electronic components, such as microprocessors.The APR23-23-15CB/A01 is a type of heat sink designed for use in applications requiring high thermal efficiency. This heat sink features an aluminum fin design with a total width of 0.233 inches and a length of 0.330 inches. The extruded shape of these fins helps to increase the overall surface area, allowing for a more efficient heat dissipation.The working principle of the APR23-23-15CB/A01 is relatively straightforward. Heat generated by an electronics component is transferred via conduction to the fins of the heat sink. The large surface area of the fins then facilitates the rapid dissipation and absorption of the heat away from the component. The heat will then be dissipated into the surrounding environment via convection.The APR23-23-15CB/A01 is a robust heat sink designed for heavy-duty applications. It is constructed from high-quality aluminum that is resistant to heat and corrosion. The fins are also designed in such a way as to provide good air ventilation, allowing for increased heat dissipation efficiency. Furthermore, the heat sink\'s lightweight design makes it ideal for use in compact and portable electronics, such as laptop computers and mobile phones.Overall, the APR23-23-15CB/A01 is an excellent choice for applications requiring effective heat dissipation. The device is suitable for use in a variety of situations, from consumer electronics to industrial and automotive applications. The heat sink\'s efficient design and reliable construction provide years of reliable performance in even the toughest environments.

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