APR23-23-18CB/A01

Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	0.890" (22.61mm)
Width:	0.890" (22.61mm)
Diameter:	--
Height Off Base (Height of Fin):	0.693" (17.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.26°C/W @ 200 LFM
Thermal Resistance @ Natural:	13.54°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Thermal - Heat Sinks: Introduction to APR23-23-18CB/A01

Thermal - Heat Sinks are essential components for any electronic device used in high temperature as they provide an efficient way of dissipating excessive thermal energy into surrounding air or water. APR23-23-18CB/A01 is a widely used heat sink today, specifically designed for temperature controlling and heat dissipation of electronic components in the following applications: VR(Virtual Reality), computer cooling (CPU cooling), medical equipment, automotive industry, high-frequency devices, LED lighting, and game consoles.

Features of APR23-23-18CB/A01 Heat Sink

APR23-23-18CB/A01 is a one-piece design which consists of a base, an adjustable fin, and a series of heat pipes. The base is made of copper which has the advantage of better thermal conductivity than other materials. The fins are made of aluminum which is effective for dissipating heat quickly, allowing airflow to pass through the fins easily. What makes APR23-23-18CB/A01 unique is its Super Low Resistance (SLR) technology. SLR technology allows more efficient heat conduction with a lower resistance and lower pressure drops.

Working Principle of APR23-23-18CB/A01 Heat Sink

The working principle of a heat sink is simple; it captures heat from the surrounding area and dissipates it away from the device using either natural or forced compression airflow. In APR23-23-18CB/A01, this heat is absorbed by the heat pipes in the base and conducted to the fins on the top surface. This is where the natural or forced airflow circulates through the fins and dissipates the heat into the atmosphere, providing a cooling effect for the device.

Benefits of Using APR23-23-18CB/A01 Heat Sink

The SLR Technology of APR23-23-18CB/A01 further increases its efficiency as it provides a low-pressure drop and increased heat transfer with a lower resistance. The fin design of the heat sink allows for convenient mounting and a sleek aesthetic look. Furthermore, its one-piece structure ensures superior heat dissipation and decreases total installation time.Apart from efficient cooling performance, APR23-23-18CB/A01 also has other added benefits such as vibration resistance, higher temperature tolerance, and increased durability. Its vibration resistance adds extra stability to the system and reduces the risk of malfunction due to mechanical shock or vibration. Furthermore, its tolerance for extreme temperatures, up to 120℃, helps increase product lifespan.

Conclusion

In conclusion, APR23-23-18CB/A01 Heat Sinks are among the best cooling solutions for electronics. Their many unique features make them an ideal product for temperature controlling and heat dissipation applications. With its low pressure drop and increased thermal conductivity, it provides optimal performance and efficient cooling in all types of environments.

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