APR23-23-33CB/A01

Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	0.890" (22.61mm)
Width:	0.890" (22.61mm)
Diameter:	--
Height Off Base (Height of Fin):	1.283" (32.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.99°C/W @ 200 LFM
Thermal Resistance @ Natural:	11.29°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Thermal - Heat Sinks APR23-23-33CB/A01 application field and working principle are hot topics in the field of thermal and heat sinks. With the energy efficiency demands rising, and the need for integrated solutions and efficient cooling technology, heat sinks have been gaining adoption in a wide range of electronics applications.Heat sinks are devices that absorb and dissipate heat generated by electronic components and circuits to help keep components cool. They are used in applications such as computers, TVs, cell phones, LED lighting and server racks. Heat sinks are usually constructed of aluminum, copper, or composite material, and feature small finned protrusions that enhance surface area and act as additional heat transfer surfaces.The APR23-23-33CB/A01 is a high-efficiency heat sink designed for applications such as LEDs, medical technology, automotive, and consumer electronics applications. It is comprised of a top aluminum fin stack and a bottom copper base, with integrated heat pipes sandwiched between them. The sink features optimized fin spacing, resulting in increased heat dissipation levels. This heat sink is incredibly effective at dissipating thermal energy from the components it is attached to.The efficient APR23-23-33CB/A01 heat sink is capable of dissipating large amounts of heat produced by a large number of components without significantly degrading the components’ performance. The heat sink works by first absorbing thermal energy from the components it is cooling and then transferring this energy to the atmosphere through convection, conduction, and radiation. As thermal energy is transferred to the heat sink’s fins, air is drawn through the fins. This air then passes over the components, taking the heat away from them, which helps to keep the components running cool.The APR23-23-33CB/A01 heat sink is optimized to provide maximum heat transfer for a wide range of applications. Its broad, flat fins allow for even heat distribution across the entire length of the sink. The fin stack is tapered, which increases surface area for greater absorption of thermal energy. The integrated heat pipes further maximize the amount of heat that can be transferred from the components to the sink.The APR23-23-33CB/A01 heat sink is a high-performance solution that offers reliable, efficient cooling for a variety of electronic components. Its flat, broad design allows for maximum heat transfer from the components, while its integrated heat pipes ensure maximum heat transfer to the atmosphere. The APR23-23-33CB/A01 is easily mountable, and is available in various sizes and shapes, allowing for use in a variety of applications.

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