| Allicdata Part #: | APR29-29-21CB/A01-ND |
| Manufacturer Part#: |
APR29-29-21CB/A01 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CTS Thermal Management Products |
| Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  APR29-29-21CB/A01 Datasheet/PDF |
| Quantity: | 1000 |
| 100 +: | $ 4.13652 |
Specifications
| Series: | APR |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.126" (28.60mm) |
| Width: | 1.126" (28.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.811" (20.60mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.47°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 11.63°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are devices used to dissipate heat from a hot surface to either a cooler environment, or to another surface with a different heat resistance. The APR29-29-21CB/A01 are a type of thermal-heat sinks used to efficiently dissipate heat from printed circuit boards (PCBs). The heat sink works by utilizing convection and conduction to transfer heat away from the source and provide a cooling effect.The heat sink works by dissipating excess heat from the circuit board via two processes; convection and conduction. Convection is the process by which heat is transferred from a hot body to a cooler body, like flowing air. Heat is transferred when the cooler air particles make contact with a hot surface and transfer some of the heat from the hot surface to the cooler surrounding environment. Conduction is the process of transferring heat from one solid object to another. This is the primary means by which the APR29-29-21CB/A01 transfers heat away from the board. The heat sink acts as a conduit, collecting the heat from the board and drawing it away via thermal conduction.The APR29-29-21CB/A01 consist of a metal alloy such as aluminum, copper, or stainless steel, which is machined to provide an optimum surface area, allowing maximum conductivity and heat transfer. The heat sink’s design also includes a finned surface. The fins help to increase the sink’s surface area, allowing it to disperse heat more efficiently. This conduction and convection process helps to reduce the overall temperature of the PCB, allowing components to run faster and more efficiently. The process of convection and conduction also helps to increase the durability of the PCB as components heat and cool regularly, preventing burn out or other damage caused by excessive heat.When it comes to installation, the APR29-29-21CB/A01 can be mounted directly onto a PCB with mounting screws, or with a heat sink clip. The heat sink clip is an easy and effective way to attach the heat sink to the PCB, as it allows for quick installation and removal. Additionally, the heat sink clip also prevents any buildup of electrostatic discharge from occurring.The APR29-29-21CB/A01 are an efficient and reliable means of dissipating heat from a printed circuit board. Utilizing both convection and conduction to draw away heat from the source, the APR29-29-21CB/A01 provide a cooling effect for PCBs and components, ensuring longer life and better performance.
The specific data is subject to PDF, and the above content is for reference
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