FDD2612 Allicdata Electronics
Allicdata Part #:

FDD2612-ND

Manufacturer Part#:

FDD2612

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: ON Semiconductor
Short Description: MOSFET N-CH 200V 4.9A D-PAK
More Detail: N-Channel 200V 4.9A (Ta) 42W (Ta) Surface Mount TO...
DataSheet: FDD2612 datasheetFDD2612 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Vgs(th) (Max) @ Id: 4.5V @ 250µA
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Supplier Device Package: TO-252
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Power Dissipation (Max): 42W (Ta)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 234pF @ 100V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 11nC @ 10V
Series: PowerTrench®
Rds On (Max) @ Id, Vgs: 720 mOhm @ 1.5A, 10V
Drive Voltage (Max Rds On, Min Rds On): 10V
Current - Continuous Drain (Id) @ 25°C: 4.9A (Ta)
Drain to Source Voltage (Vdss): 200V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Obsolete
Packaging: Tape & Reel (TR) 
Description

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The FDD2612 is a single p-channel field-effect transistor (FET). It is a depletion mode Metal Oxide Semiconductor Field-effect Transistor (MOSFET). The device is manufactured on an advanced N-well process technology, which allows it to operate over a wide range of temperature, from -55 to +150 °C.

Depletion mode FETs are used for several applications such as analog switching, digital switching, and low-side switching. They are primarily used in analog circuitry and have a wide variety of uses ranging from basic amplifiers to advanced switching applications.

The FDD2612 device consists of a p-type substrate which is the base of the device. On top of the substrate, a thin layer of metal is deposited and a dielectric material is sandwiched between the metal and the substrate. The metal in this device consists of aluminum, titanium, and other metals. The dielectric material is typically silicon dioxide. The metal and the dielectric are etched to form the gate, source, and drain of the device.

The working principle of an FDD2612 device is based on the charge carriers in the semiconductor material. The maximum number of electrons inside the drain region is always greater than the maximum number of holes inside the source region. This charge imbalance creates a potential difference in the FET. When a voltage is applied to the gate, this potential difference is increased because more electrons are drawn to the gate. This increase in potential difference is an indication of an increase in the current in the drain-source circuit, which is the working principle of an FDD2612 device.

The FDD2612 device is widely used in power systems and circuits. It is well-suited for applications that require high power switching, such as high-side switching, low-side switching, power mosfet switching, and relay circuits. The device is also used in various analog switching and control circuits, such as relay drivers, power supplies, and power converters. In addition, the FDD2612 device is widely used in pulse width modulated (PWM) and pulse-code modulation (PCM) circuits.

The FDD2612 is an excellent choice for applications requiring low voltage, low leakage, low noise, and high-current capability. Furthermore, it has a low noise threshold, making it attractive for sensitive analog audio applications. In addition, this device has a fast switching time and high efficiency, which makes it suitable for high-speed applications.

In conclusion, the FDD2612 is a single p-channel FET device and is suitable for a wide range of applications, such as power systems, digital switching, and analog switching and control. Its ability to operate over a wide temperature range and its low noise threshold make it an excellent choice for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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