IS66WVC4M16EALL-7010BLI

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Memory technology continues to progress at a rapid rate due to advances in semiconductor and packaging technology. As a result, ever-larger and faster memories are being introduced to the market. IS66WVC4M16EALL-7010BLI is one new example of a recent memory innovation that promises to provide significant performance advantages to a wide variety of applications. In this article, we\'ll take a look at the application fields and working principles of the IS66WVC4M16EALL-7010BLI.

IS66WVC4M16EALL-7010BLI Specifications and Characteristics

In terms of physical parameters, the IS66WVC4M16EALL-7010BLI is a very small form factor memory module with dimensions of only 1.8 mm x 2.1 mm. It features dual-rank burst cycle performance with support for x16 data bus width and a voltage rating of 1.8V ± 0.2V. The module\'s capacity is 4GB, and it is packaged in a low-profile green flip-chip BGA package. The IS66WVC4M16EALL-7010BLI also features a wide range of performance parameters, including a maximum clock frequency of 1600MHz, an access latency of 5.75ns and a data transfer rate of 12.8GB/s.

Applications of the IS66WVC4M16EALL-7010BLI

The IS66WVC4M16EALL-7010BLI is ideal for applications that require high data throughput. It is well suited for use in digital video recorder (DVR), network equipment, network-attached storage (NAS), infotainment systems, and other embedded applications where the capability to access large amounts of data quickly is of paramount importance. The combination of small form factor, low power requirements and high performance make the IS66WVC4M16EALL-7010BLI particularly attractive to these types of applications.

Working Principle of the IS66WVC4M16EALL-7010BLI

The working principle of the IS66WVC4M16EALL-7010BLI is based on DDR3 SDRAM technology. It utilizes a 16-bit data bus interface and a double-rank architecture, which allows for simultaneous access of two independent memory chips in different ranks. This type of architecture enables the memory module to achieve high data throughput while still operating at relatively low power and in a small physical package. Additionally, the IS66WVC4M16EALL-7010BLI features error-correcting code (ECC) support, which can help guard against data corruption in critical applications.

Conclusion

The IS66WVC4M16EALL-7010BLI is a small form factor, high performance memory module that is well suited for embedded applications that require sustained high data throughput. It is available in a 4GB capacity and features a dual-rank burst cycle performance, a 1600MHz clock frequency and a data transfer rate of 12.8GB/s. Additionally, the module supports error-correcting code (ECC) and is packaged in a low-profile green flip-chip BGA. Thanks to its small size and high performance, the IS66WVC4M16EALL-7010BLI is an attractive solution for many different types of embedded applications.

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