IXGR32N60CD1 Allicdata Electronics
Allicdata Part #:

IXGR32N60CD1-ND

Manufacturer Part#:

IXGR32N60CD1

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: IXYS
Short Description: IGBT 600V 45A 140W ISOPLUS247
More Detail: IGBT 600V 45A 140W Through Hole ISOPLUS247™
DataSheet: IXGR32N60CD1 datasheetIXGR32N60CD1 Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Input Type: Standard
Base Part Number: IXG*32N60
Supplier Device Package: ISOPLUS247™
Package / Case: ISOPLUS247™
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Reverse Recovery Time (trr): 25ns
Test Condition: 480V, 32A, 4.7 Ohm, 15V
Td (on/off) @ 25°C: 25ns/85ns
Gate Charge: 110nC
Series: HiPerFAST™
Switching Energy: 320µJ (off)
Power - Max: 140W
Vce(on) (Max) @ Vge, Ic: 2.7V @ 15V, 32A
Current - Collector Pulsed (Icm): 120A
Current - Collector (Ic) (Max): 45A
Voltage - Collector Emitter Breakdown (Max): 600V
IGBT Type: --
Part Status: Obsolete
Packaging: Tube 
Description

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The IXGR32N60CD1 is a single IGBT module with a rated collector-emitter voltage of 600V. This transistor is used for high current and/or high frequency switching applications. It is a low-voltage IGBT device with a low gate charge and low driving power. It is suitable for a variety of applications where cost, low switching losses and high switching frequencies are critical.

The basic structure of the IXGR32N60CD1 consists of an insulated-gate field-effect transistor (IGFET) formed in a vertical double-diffused metal-oxide-semiconductor field-effect transistor (DMOSFET) process. It is composed of a vertical PNP bipolar transistor and an insulated-gate-fusion-transistor cell having a positive-temperature coefficient channel. The IGFET is connected in a simple single transistor configuration, instead of the usual (EMS) three-transistor configuration. This provides improved performance due to its improved speed and bypassing the switching losses associated with the EMS design.

The IXGR32N60CD1 has a maximum channel current density Jc of 19 A/cm2 and a channel breakdown voltage of 600V, making it suitable for industrial, telecom, and transportation applications that require high current and/or high switching frequencies. It also has a wide gate-emitter voltage (VGE) drive range from 8V to 15V, giving it the capability to switch faster than other IGBTs on the market.

The IXGR32N60CD1 uses a wide range of materials in their production, such as silicon carbide, gallium nitride, and silicon carbide passivation layer. The layers are placed in a vertical structure, which allows for a lower on-resistance and a faster switching speed. The passivation layer also acts as an insulation layer, limiting the amount of heat generated during high-speed switching applications.

The IXGR32N60CD1 has low capacitance and low switching losses, which makes it well-suited for use in applications that require high-speed switching. It also has a low gate charge, allowing for a lower gate-emitter voltage (VGE) drive range and improved turn-on times. The IXGR32N60CD1 is equipped with an integrated circuit (IC) that helps to limit the maximum VGE voltage and provides current-sensing circuitry.

The IXGR32N60CD1 is highly reliable and robust against surge currents due to its vertical double-diffused MOSFET (VDMOS) structure, which prevents short circuits and reduces power losses caused by high surge currents. The device is also fully RoHS-compliant, making it an ideal choice for applications that need to adhere to the latest safety regulations.

In summary, the IXGR32N60CD1 is a single IGBT module that is suitable for high current and/or high frequency switching applications. It has a low gate charge, low on-resistance, and a wide VGE drive range that allow for faster switching times. It is also highly reliable and robust against surge currents due to its VDMOS structure, and is RoHS compliant.

The specific data is subject to PDF, and the above content is for reference

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