NAND256W3A2BN6E Allicdata Electronics
Allicdata Part #:

NAND256W3A2BN6E-ND

Manufacturer Part#:

NAND256W3A2BN6E

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: IC FLASH 256M PARALLEL 48TSOP
More Detail: FLASH - NAND Memory IC 256Mb (32M x 8) Parallel 5...
DataSheet: NAND256W3A2BN6E datasheetNAND256W3A2BN6E Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Part Status: Obsolete
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NAND
Memory Size: 256Mb (32M x 8)
Write Cycle Time - Word, Page: 50ns
Access Time: 50ns
Memory Interface: Parallel
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package: 48-TSOP
Base Part Number: NAND256-A
Description

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NAND256W3A2BN6E is one of the most popular memory components used in today’s digital products. It is a type of non-volatile Flash memory component that stores digital information even when power is removed from the system making it a great choice for digital products with needs for data storage such as audio players,hard disk drives, digital cameras, digital voice recorders and many more. The NAND256W3A2BN6E component provides flexible data storage capabilities in several different configurations.

The NAND256W3A2BN6E component is composed of two tiers: a Flash memory precursor and a large NAND Flash array. The large NAND Flash array consists of 256 blocks, which can store up to 8 pages per block. Each page consists of 8,192 8 bit bytes and acts as an individual storage cell. The Flash memory precursor, located just prior to the large NAND Flash array, contains instructions, functions and control features needed to access and maintain the data within the array. The instructions, functions and control features are written in Serial NAND Interface Language (SNIL).

When the NAND256W3A2BN6E component is running, the Flash memory precursor and array access the data in the same manner, which is known as "on die". This type of access is extremely fast and efficient, enabling quick data access and retrieval. Additionally, since there is no need for external memory access, the NAND256W3A2BN6E component offers much lower power consumption than other memory components.

The NAND256W3A2BN6E component is used in a variety of applications, including video, graphics and audio applications. It is also used in gaming, storage and mobile applications. Due to its fast access time, NAND256W3A2BN6E is also employed in high performance computer systems, such as servers and workstations. The robust design and long storage life of the component make it ideal for applications requiring long-term data storage.

The NAND256W3A2BN6E component is also employed in automotive, industrial and medical applications. These applications benefit from the component’s low power consumption and reliability for long-term data storage. Additionally, since the component is non-volatile and does not need to be regularly backed up, these applications can benefit from cost savings when compared to hard drive-based storage products.

The NAND256W3A2BN6E component utilizes a standard interface to simplify integration into systems, regardless of a system’s architecture. It supports the industry standard Serial Peripheral Interface (SPI) for interfacing with a microcontroller, allowing for fast and easy execution of instructions. It also has an on-chip boot ROM to support booting directly from the component.

In conclusion, the NAND256W3A2BN6E component is a reliable and efficient memory component that is used in many different types of applications. It features fast access times, low power consumption and long storage life, making it well suited for applications requiring long-term data storage. Additionally, its support for the industry standard SPI interface and on-chip boot ROM simplify integration into various systems, providing cost savings and expedited development timelines.

The specific data is subject to PDF, and the above content is for reference

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