Bus power controller - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
GD32F103CBT6-ST	GD32F103CBT6	GigaDevice Semiconductor (HK) Limited	View more Series: GD32F Packaging: LQFP-48 Applications: industrial control,motor driven,Power monitoring,Call the police Core Processor: ARMCortex-M3 Program Memory Type: Flash capacity Controller Series: ARM microcontroller RAM Size: 3MB Interface: 10 Number of I/O: 37 Voltage - Supply: 2.6V to 3.6 V Operating Temperature: -40 to +85C Mounting Type: SMD, MCU Package / Case: tray Base Part Number: GD32F103CBT6	5000 Order	--
GD32F407VET6-ST	GD32F407VET6	GigaDevice Semiconductor (HK) Limited	View more	0 RFQ	--
DSPIC33EP256MU8 06-E/PT-ND	DSPIC33EP256MU8 06-E/PT	Microchip Technology	View more Series: dsPIC 33EP Packaging: Tray Part Status: Active Applications: Induction Heating, Uninterruptible Power Supply (UPS), DC/AC Inverter, Compressor Motor Control, BLDC Motor Control, Inlet Motor Control Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: CANbus, IC, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Interface: CANI2CSPIUART Number of I/O: 51 Program Memory Size: 256KB (85.5K x 24) Voltage - Supply: 3V ~ 3.6V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 12K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 24x10b/12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-TQFP Supplier Device Package: 64-TQFP (10x10) Base Part Number: DSPIC33EP256MU806	12500 Order	--
GD32F405RGT6-ST	GD32F405RGT6	GigaDevice Semiconductor (HK) Limited	View more	8852 Order	--
GD32F103RET6-ST	GD32F103RET6	GigaDevice Semiconductor (HK) Limited	View more Series: GD32F103 Core Processor: ARMCortex-M3 Core Size: 32-Bit Speed: 108MHz Controller Series: ARM microcontroller Connectivity: MOTOROLA 6800 AND INTEL 8080 TYPE LCD DIRECTLY Number of I/O: 51 Voltage - Supply: 2.6V ~ 3.6V EEPROM Size: 512KB Mounting Type: Patch RAM Size: 64KB Operating Temperature: -40 to ~85C Base Part Number: GD32F103RET6	6000 Order	--
MLX81120KLQ-AXX -000-SP-ND	MLX81120KLQ-AXX -000-SP	Melexis Technologies NV	View more Packaging: Bulk Part Status: Active Applications: LIN Controller Core Processor: 16-Bit RISC Program Memory Type: FLASH (32 kB), ROM (16 kB) RAM Size: 2K x 8 Interface: UART Number of I/O: 4 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 12-VFDFN Exposed Pad Supplier Device Package: 12-DFN (4x4)	1000 Order	1+: $2.5578 10+: $2.2825 25+: $2.0541 100+: $1.8714 250+: $1.6888
MLX81115KLQ-AXX -000-SP-ND	MLX81115KLQ-AXX -000-SP	Melexis Technologies NV	View more Packaging: Bulk Part Status: Active Applications: LIN Controller Core Processor: 16-Bit RISC Program Memory Type: FLASH (32 kB), ROM (16 kB) RAM Size: 2K x 8 Interface: SPI Number of I/O: 6 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 12-VFDFN Exposed Pad Supplier Device Package: 12-DFN (4x4)	1000 Order	1+: $2.4633 10+: $2.1993 25+: $1.9795 100+: $1.8036 250+: $1.6276
MLX81112KDC-AXX -000-SP-ND	MLX81112KDC-AXX -000-SP	Melexis Technologies NV	View more Packaging: Bulk Part Status: Active Applications: LIN Controller Core Processor: 16-Bit RISC Program Memory Type: FLASH (32 kB), ROM (16 kB) RAM Size: 2K x 8 Interface: SPI Number of I/O: 4 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $2.1861 10+: $1.9517 25+: $1.7562 100+: $1.6002 250+: $1.4441
SPC5566MZP80R-N D	SPC5566MZP80R	NXP USA Inc	View more Series: MPC55xx Qorivva Packaging: Tape & Reel (TR) Part Status: Active Core Processor: e200z6 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 3MB (3M x 8) Voltage - Supply: 1.35V ~ 1.65V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27) Base Part Number: SPC5566	250 Order	1+: $114.92
GD32F103RBT6-ST	GD32F103RBT6	GigaDevice Semiconductor (HK) Limited	View more Number of I/O: 80 Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V	8888 Order	--
MLX81115KLQ-AXX -000-RE-ND	MLX81115KLQ-AXX -000-RE	Melexis Technologies NV	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: LIN Controller Core Processor: 16-Bit RISC Program Memory Type: FLASH (32 kB), ROM (16 kB) RAM Size: 2K x 8 Interface: SPI Number of I/O: 6 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 12-VFDFN Exposed Pad Supplier Device Package: 12-DFN (4x4)	1000 Order	1+: $0
MLX81120KLQ-AXX -000-RE-ND	MLX81120KLQ-AXX -000-RE	Melexis Technologies NV	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: LIN Controller Core Processor: 16-Bit RISC Program Memory Type: FLASH (32 kB), ROM (16 kB) RAM Size: 2K x 8 Interface: UART Number of I/O: 4 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 12-VFDFN Exposed Pad Supplier Device Package: 12-DFN (4x4)	1000 Order	1+: $0
MLX81112KDC-AXX -000-RE-ND	MLX81112KDC-AXX -000-RE	Melexis Technologies NV	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: LIN Controller Core Processor: 16-Bit RISC Program Memory Type: FLASH (32 kB), ROM (16 kB) RAM Size: 2K x 8 Interface: SPI Number of I/O: 4 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	1+: $0
568-11343-ND	LPC1519JBD64E	NXP USA Inc	View more Series: LPC15xx Packaging: Tray Part Status: Active Applications: Industrial and medical, motor control, home appliances, digital power Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Controller Series: ARM Microcontrollers - MCU Connectivity: CANbus, IC, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Interface: CAN, I2C, SPI Number of I/O: 46 Program Memory Size: 256KB (256K x 8) Voltage - Supply: 2.4 V ~ 3.6 V Program Memory Type: FLASH EEPROM Size: 4K x 8 Mounting Type: Surface Mount RAM Size: 36K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: LPC1519	13492 Order	--
TM4C123GE6PZT7R -ND	TM4C123GE6PZT7R	Texas Instruments	View more Series: Tiva C Packaging: Tape & Reel (TR) Part Status: Active Applications: Low power consumption, motion control, factory automation, medical equipment, transportation Core Processor: ARM Cortex-M4F Core Size: 32-Bit Speed: 80MHz Controller Series: ARM Microcontrollers - MCU Connectivity: CANbus, IC, IrDA, Microwire, QEI, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, Motion PWM, POR, WDT Interface: I2C, SSI, USB Number of I/O: 69 Program Memory Size: 128KB (128K x 8) Voltage - Supply: 1.08 V ~ 3.63 V Program Memory Type: FLASH EEPROM Size: 2K x 8 Mounting Type: Surface Mount RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.63 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: TM4C123	21000 Order	--
497-6443-ND	STM32F103VET6	STMicroelectronics	View more Series: STM32F1 Packaging: Tray Part Status: Active Applications: Motor drives, industrial applications, application control, medical device applications Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, IrDA, LINbus, SPI, UART/USART, USB Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT Interface: CAN, I2C, SPI Number of I/O: 80 Program Memory Size: 512KB (512K x 8) Voltage - Supply: 2V ~ 3.6V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 16x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Base Part Number: STM32F103	100 Order	--
568-4788-ND	LPC1751FBD80,55 1	NXP USA Inc	View more Series: LPC17xx Packaging: Tray Part Status: Active Applications: Electronic metering, lighting, industrial network, motor control Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 100MHz Controller Series: ARM Cortex-M3 series Microcontroller Connectivity: CANbus, IC, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Interface: I2C, SPI, UART Number of I/O: 52 Program Memory Size: 32KB (32K x 8) Voltage - Supply: 2.4 V ~ 3.6 V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 6x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: LPC1751	19499 Order	--
568-14452-ND	LPC1853FET256,5 51	NXP USA Inc	View more Series: LPC18xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 150MHz Connectivity: CANbus, EBI/EMI, Ethernet, IC, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, IS, LCD, Motor Control PWM, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 16x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17) Base Part Number: LPC1853	360 Order	1+: $213.43
296-37952-ND	TM4C1299NCZADI3	Texas Instruments	View more Series: Tiva C Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4F Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, EBI/EMI, Ethernet, IC, IrDA, QEI, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, Motion Control PWM, POR, PWM, WDT Number of I/O: 140 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 6K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.97 V ~ 3.63 V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 212-VFBGA Supplier Device Package: 212-NFBGA (10x10)	1244 Order	1+: $82.08
568-4793-ND	LPC1764FBD100,5 51	NXP USA Inc	View more Series: LPC17xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, Ethernet, IC, IrDA, Microwire, SPI, SSI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: LPC1764	1322 Order	1+: $5.1156 10+: $4.6229 100+: $3.8273 500+: $3.3328 1000+: $2.9028
PIC32MK0512GPD0 64-I/PT-ND	PIC32MK0512GPD0 64-I/PT	Microchip Technology	View more Series: PIC 32MK Packaging: Tray Part Status: Active Core Processor: MIPS32 microAptiv Core Size: 32-Bit Speed: 120MHz Connectivity: IrDA, LINbus, PMP, QEI, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, IS, POR, Motor Control PWM, WDT Number of I/O: 48 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 26x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-TQFP Supplier Device Package: 64-TQFP (10x10)	6100 Order	--
497-9033-ND	STM32F103RCT6	STMicroelectronics	View more Series: STM32F1 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, IrDA, LINbus, SPI, UART/USART, USB Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT Number of I/O: 51 Program Memory Size: 256KB (256K x 8) Voltage - Supply: 2V ~ 3.6V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 16x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-LQFP Base Part Number: STM32F103	18537 Order	--
DSPIC33EP512GM3 10-I/PT-ND	DSPIC33EP512GM3 10-I/PT	Microchip Technology	View more Series: dsPIC 33EP Packaging: Tray Part Status: Active Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: IC, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, IS, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (12x12) Base Part Number: DSPIC33EP512GM310	34 Order	1+: $85
DSPIC33EP512GM3 10-E/PT-ND	DSPIC33EP512GM3 10-E/PT	Microchip Technology	View more Series: dsPIC 33EP Packaging: Tray Part Status: Active Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: IC, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, IS, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (12x12) Base Part Number: DSPIC33EP512GM310	856 Order	1+: $50
497-9034-ND	STM32F103VCT6	STMicroelectronics	View more Series: STM32F1 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, IrDA, LINbus, SPI, UART/USART, USB Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT Number of I/O: 80 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 16x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Base Part Number: STM32F103	818 Order	1+: $4.3722 10+: $3.9488 100+: $3.2695 500+: $2.847 1000+: $2.4796
497-6444-ND	STM32F103RET6	STMicroelectronics	View more Series: STM32F1 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, IrDA, LINbus, SPI, UART/USART, USB Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT Number of I/O: 51 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 16x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-LQFP Base Part Number: STM32F103	3152 Order	--
SPC5606BK0MLU6R -ND	SPC5606BK0MLU6R	NXP USA Inc	View more Series: MPC56xx Qorivva Packaging: Tape & Reel (TR) Part Status: Active Applications: Central body controllers Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 1MB (1M x 8) Voltage - Supply: 3 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 64K x 8 Mounting Type: Surface Mount RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24) Base Part Number: SPC5606	37000 Order	--
497-6063-ND	STM32F103C8T6	STMicroelectronics	View more Series: STM32F1 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, IrDA, LINbus, SPI, UART/USART, USB Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT Interface: CAN, I2C, SPI, USART, USB Number of I/O: 37 Program Memory Size: 64KB (64K x 8) Voltage - Supply: 2V ~ 3.6V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 20K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 48-LQFP Base Part Number: STM32F103	6042 Order	--
SPC5777CDK3MME4 R-ND	SPC5777CDK3MME4 R	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	500+: $25.38
SPC5777CDK3MMO4 R-ND	SPC5777CDK3MMO4 R	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	500+: $26.595
SPC5777CDK3MME4 -ND	SPC5777CDK3MME4	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	200+: $27.3685
568-14629-ND	SPC5775EDK3MME3	NXP USA Inc	View more Series: * Part Status: Active	200 Order	1+: $24.7527 10+: $23.0939 100+: $20.0513
SPC5775EDK3MME3 R-ND	SPC5775EDK3MME3 R	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	500+: $17.1359
SPC5777CDK3MMO4 -ND	SPC5777CDK3MMO4	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	200+: $27.5057
DF2148BFA20IV-N D	DF2148BFA20IV	Renesas Electronics America	View more Series: H8 H8S/2100 Packaging: Tray Part Status: Active Core Processor: H8S/2000 Core Size: 16-Bit Speed: 20MHz Connectivity: IC, IrDA, SCI, X-Bus Peripherals: PWM, WDT Number of I/O: 74 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b; D/A 2x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-BFQFP Supplier Device Package: 100-QFP (14x14) Base Part Number: DF2148	1000 Order	180+: $10.3244 270+: $9.4135 540+: $8.8061 1080+: $8.0774
MC912D60AMFUE8- ND	MC912D60AMFUE8	NXP USA Inc	View more Series: HC12 Packaging: Tray Part Status: Not For New Designs Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 48 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8/10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14) Base Part Number: MC912D60	1000 Order	420+: $14.9997
MC912D60ACFUE8- ND	MC912D60ACFUE8	NXP USA Inc	View more Series: HC12 Packaging: Tray Part Status: Not For New Designs Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 48 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8/10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14) Base Part Number: MC912D60	319 Order	1+: $18.1314 10+: $16.7202 100+: $14.2778
MC912D60ACPV8-N D	MC912D60ACPV8	NXP USA Inc	View more Series: HC12 Packaging: Tray Part Status: Obsolete Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 68 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20) Base Part Number: MC912D60	1000 Order	--
DF2161BVT10V-ND	DF2161BVT10V	Renesas Electronics America	View more Series: H8 H8S/2100 Packaging: Tray Part Status: Active Core Processor: H8S/2000 Core Size: 16-Bit Speed: 10MHz Connectivity: Host Interface (LPC), IC, IrDA, SCI, X-Bus Peripherals: PWM, WDT Number of I/O: 114 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 2x8b Oscillator Type: Internal Operating Temperature: -20C ~ 75C (TA) Package / Case: 144-TQFP Supplier Device Package: 144-TQFP (16x16) Base Part Number: DF2161	1000 Order	--
MC912D60AVPVE8- ND	MC912D60AVPVE8	NXP USA Inc	View more Series: HC12 Packaging: Tray Part Status: Not For New Designs Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 68 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20) Base Part Number: MC912D60	1000 Order	300+: $14.4607

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