APR31-31-23CB/A01

Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.205" (30.61mm)
Width:	1.205" (30.61mm)
Diameter:	--
Height Off Base (Height of Fin):	0.890" (22.61mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.78°C/W @ 200 LFM
Thermal Resistance @ Natural:	10.71°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Introduction to Thermal - Heat Sinks and the APR31-31-23CB/A01 Application Field and Working Principle

Thermal - Heat Sinks are devices designed to dissipate a large amount of heat away from a system. These devices are generally used in thermal management of electronic systems, such as computer processing, power supplies, and communications equipment. The performance of such systems depends on the efficiency of their thermal management. Heat sinks are designed to optimize heat dissipation by dissipating heat away from components of a system and moving it to the outside environment.The APR31-31-23CB/A01 is a high-performance heat sink designed for thermal management in communication systems. It is suitable for a wide range of applications, including mobile or portable devices, base stations, high-speed electronics, and more. The heat sink is designed to provide excellent thermal performance, superior reliability, and cost-effectiveness.

Design Features and Performance of the APR31-31-23CB/A01 Heat Sink

The APR31-31-23CB/A01 heat sink is a sophisticated device, designed to provide excellent performance with a minimum of volume and weight. The device incorporates proprietary cooling technology, which provides superior thermal management. The design includes an integrated dielectric and foam substrate that provides low-cost heat transfer while also helping to minimize noise. The heat sink is also designed with a patented active cooling system which draws heat away from the base and dissipates it into the atmosphere. As a result, thermal performance is optimized, and system reliability is improved.

Technical Characteristics of the APR31-31-23CB/A01 Heat Sink

The APR31-31-23CB/A01 heat sink has a number of technical characteristics that make it an effective thermal management solution.First, the device has a high thermal conductivity rating, which allows it to efficiently draw heat away from the system and dissipate it into the atmosphere. The device also has a low thermal impedance rating, meaning that it is better able to address sudden changes in temperature than other thermal management solutions. The heat sink also has a very low profile, allowing it to fit into tight enclosures without sacrificing thermal performance.In addition, the device features a passive cooling system which draws heat away from components even when the system is turned off. This helps to maintain reliable operation during long inactive periods. The heat sink is also designed to be lightweight, yet durable, making it easy to install in applications with limited space.

Conclusion

The APR31-31-23CB/A01heat sink is a high-performance thermal management solution. It offers superior thermal performance, reliability, and cost-effectiveness, making it an excellent choice for thermal management in communication systems. The design incorporates proprietary cooling technology, a low thermal impedance rating, and a lightweight yet durable construction. As a result, the device is well-suited for a variety of applications, from mobile or portable devices to base stations and high-speed electronics.

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