Allicdata Part #: | APR33-33-28CB/A01-ND |
Manufacturer Part#: |
APR33-33-28CB/A01 |
Price: | $ 4.99 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | APR33-33-28CB/A01 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 4.49373 |
Series: | APR |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 1.283" (32.60mm) |
Width: | 1.283" (32.60mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.087" (27.60mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.33°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 9.40°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks: APR33-33-28CB/A01 Application Field and Working Principle
Heat sinks are popular thermal devices used in modern electronics to dissipate and regulate heat. The APR33-33-28CB/A01 heat sink by API Technologies is a 3-year-old device made of aluminum that is designed to effectively cool the components of industrial or consumer electronics.
The APR33-33-28CB/A01 heat sink is designed to fit a device or component that has a surface area of 33 cm² or less. It is made of aluminum because it is a highly effective material for conducting and dissipating heat. The heat sink is 33 mm wide, 33 mm long, and 28.5 mm tall and has a notched profile surface area, which gives it a 0.5 mm clocked edge to work optimally with the device or component it is attached to.
The APR33-33-28CB/A01 heat sink uses natural convection as its cooling principle, and has an optimal air space clearance of 2 mm between the base and the heat sink\'s fins, in order to create an effective air flow. The device does not require any additional cooling fans, which results in lower overall noise for the consumer. In order to mount the heat sink onto the device or component, the heat sink must be attached using either traditional mounting hardware or a thermal adhesive.
The APR33-33-28CB/A01 heat sink is designed for a wide range of applications. It is most commonly used in industrial or consumer electronics such as computers, laptops, gaming consoles, and audio-video equipment. It can also be used in laboratory or scientific instruments, automotive and telecommunication components, and 3D printing components.
The APR33-33-28CB/A01 heat sink is designed for optimal efficiency. It is capable of dissipating heat up to 45 W of thermal energy, and has a coefficient of thermal resistance (CTR) value of 0.19°C/W, which is excellent for its size and price. It also has a high-density aluminum alloy fin (A9411-8) that is designed to last up to 60,000 hours without any degradation in performance.
In summary, the APR33-33-28CB/A01 heat sink by API Technologies is a reliable, cost-effective, and space-saving device designed to dissipate and regulate heat from a wide range of industrial or consumer electronics. It uses natural convection to create an effective air flow and has an excellent coefficient of thermal resistance (CTR) value. With its 0.5 mm clocked edge and aluminum alloy fin, the device can dissipate up to 45 W of thermal energy and last up to 60,000 hours.
The specific data is subject to PDF, and the above content is for reference
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