APR38-38-12CB Allicdata Electronics
Allicdata Part #:

294-1135-ND

Manufacturer Part#:

APR38-38-12CB

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED 38 X 38 X 12MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR38-38-12CB datasheetAPR38-38-12CB Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Pin Fins
Length: 1.461" (37.10mm)
Width: 1.461" (37.10mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are essential components used in the operation and maintenance of hardware and system components. The APR38-38-12CB is a specialized thermal-heat sink designed to aid in dissipating heat from sensitive electronic components. These components may include, but are not limited to, integrated circuits, processors, power supplies, and other components that are subjected to higher temperature ranges. The APR38-38-12CB utilizes an advanced design that helps to improve the overall performance and reliability of any electronic component or system.

The APR38-38-12CB is constructed of special thermally efficient materials such as aluminum and other alloys. This design helps to maximize the amount of heat that can be dissipated away from the components. In order to dissipate heat away from the components, there is a fan within the APR38-38-12CB that helps to circulate the air and provide cooling. This helps to ensure that there is a more efficient heat dissipation from the sensitive components that in turn helps to extend the life of those components. In addition, the design of the APR38-38-12CB utilizes a number of features that help to increase its overall effectiveness.

One of the primary features of the APR38-38-12CB is the use of a variable-speed fan. This allows users to customize the cooling capabilities of the device to their specific needs. This feature helps to ensure that the components are always receiving the proper cooling for their application. Additionally, the APR38-38-12CB uses a combination of fins and a heat pipe to maximize the performance of the device. The combination of these two technologies helps to ensure that the APR38-38-12CB is able to effectively dissipate heat away from the components in a wide range of applications and environments.

The APR38-38-12CB also utilizes a unique design that helps to reduce the overall size and weight of the device. This in turn allows for a more efficient design for efficient installation and operation. Additionally, the apr38-38-12cb uses specialized materials and construction techniques to ensure that the device is resilient and able to withstand intense temperatures and vibration.

The APR38-38-12CB also helps to protect the components that are using it. By providing efficient cooling, it can help to ensure that the components are not damaged by excessive heat. Additionally, the device can help to keep the electrical characteristics of the components at optimal levels so that they are able to last longer.

In conclusion, the apr38-38-12cb is an advanced thermal-heat sink that helps to improve the overall performance and reliability of any electronic component or system. The device uses advanced design features such as a variable-speed fan and a combination of fins and a heat pipe to improve its overall effectiveness. Additionally, the device utilizes a unique design that helps to reduce the overall size and weight of the device. The APR38-38-12CB is also able to protect the components it is used on by providing efficient cooling and by helping to keep the electrical characteristics of the components at optimal levels.

The specific data is subject to PDF, and the above content is for reference

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