APR38-38-18CB/A01

Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.476" (37.50mm)
Width:	1.476" (37.50mm)
Diameter:	--
Height Off Base (Height of Fin):	0.772" (19.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.66°C/W @ 200 LFM
Thermal Resistance @ Natural:	9.43°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Introduction to Thermal - Heat Sinks

Thermal - Heat Sinks are used in various applications in order to reduce the temperature of microprocessors or other electronic components. They work to dissipate heat generated by the components in order to maintain the components\' optimum performance. The most common types of thermal - heat sinks are active, passive, and forced-air cooled.

Active Heat Sinks

An active heat sink makes use of actively driven devices such as fans, pumps, or other mechanical or electrical system to aid in the transfer of heat away from an electronic component. Active heat sinks are more efficient than passive heat sinks because they create a more even distribution of the heat to prevent any temperature overload. Active heat sinks are also capable of operating at both high and low temperatures, allowing for an even distribution of heat.

Passive Heat Sinks

Unlike active heat sinks, passive heat sinks do not use fans, pumps, or other mechanical elements to aid the transfer of heat. Rather, they use simple physics products such as convection and conduction to transfer heat away from the component. Despite being more efficient, passive heat sinks are highly dependent on the surrounding temperature. If the ambient temperature is too high, then the sinks may not be able to dissipate the heat quickly enough.

Forced-Air Cooled Heat Sinks

Forced-air cooled heat sinks are the most commonly used type of thermal - heat sink. A fan is used to either blow or draw ambient air over the heat sink to help cool the components. The fan produces a uniform air pressure, which is then conducted over the heated component. This helps dissipate the heat effectively. Forced-air cooled heat sinks are more efficient than passive heat sinks and require less power.

Overview of APR38-38-18CB/A01 Heat Sinks

APR38-38-18CB/A01 heat sinks are constructed from high-grade aluminum, copper, or steel. The fins of these heat sinks are closely spaced in order to create more cooling surface area. The base of the APR38-38-18CB/A01 heat sink is designed with a large heat spreader to provide better heat dissipation. For optimal cooling, the heat sink is designed with a fan assembly consisting of a fan and mounting bracket.The APR38-38-18CB/A01 heat sink is designed for use in a variety of electronics and applications. It can be used for cooling microprocessors, circuit boards, power amplifiers, and more. The fan assembly ensures that the component is cooled to the optimal temperature level, as well as providing an even distribution of air. Additionally, the fan assembly is quiet, making it ideal for use in any environment.

Conclusion

Thermal - Heat Sinks are an important component used in various electronics and applications. They help to keep components working at the optimum temperature, as well as providing an even distribution of heat. The APR38-38-18CB/A01 heat sink is a prime example of a heat sink that is designed for optimal performance. With its high-grade materials and fan assembly, it provides efficient cooling for components, as well as being quiet and reliable.

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