APR38-38-15CB/A01

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The APR38-38-15CB/A01 thermal heat sink is designed to efficiently dissipate heat from power electronic components and assemblies. It is a compact, cost effective passive cooling device, that is suitable for applications that require protection from overheating and high temperatures. In addition to its cooling efficiency, its compact size allows for use in confined areas and tight spaces.

The APR38-38-15CB/A01 is constructed from a die-cast copper alloy material, for high fatigue strength and better heat dissipation capability. It features natural convection cooling technology, which uses natural air movement and a thermally conductive coating to disperse heat more effectively. The heat sink is rated to temperatures up to 1600°C and is designed to meet common industrial standards, such as IEC-61000, VDE-0805 and ROHS compliance. The device is designed for use with a variety of electronic components, including transistors, resistors, diodes, LEDs and power switching diodes.

The APR38-38-15CB/A01 has several unique features that make it an attractive choice for a variety of applications. It offers an extremely wide range of mounting options, allowing it to be used in nearly any configuration. It also has an ultra-low profile design, which reduces the amount of space needed to mount the device. Additionally, the device is highly durable, providing a significantly long service life.

The APR38-38-15CB/A01 is a highly effective cooling solution to power electronic assemblies. Its combination of natural convection cooling and thermally conductive coating, makes it one of the most efficient heat sink designs available. Its wide range of mounting options further increases its versatility, while its compact size makes it suitable for tight applications. And its durability ensures that it will last and outperform competitors for years to come.

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