Allicdata Part #: | APR33-33-21CB/A01-ND |
Manufacturer Part#: |
APR33-33-21CB/A01 |
Price: | $ 4.72 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | APR33-33-21CB/A01 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 4.24771 |
Series: | APR |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 1.283" (32.60mm) |
Width: | 1.283" (32.60mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.811" (20.60mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.78°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 10.54°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are an extremely important component in the efficient operation of many types of electronic devices. Heat sinks work to dissipate the generated heat from the device in order to promote the optimal level of cooling. The APR33-33-21CB/A01 heat sink is a popular item in the electronics market and is used to increase the efficiency of a variety of electronic apparatus. This article will discuss the application field and working principle of the APR33-33-21CB/A01.
The APR33-33-21CB/A01 heat sink is designed to provide cooling for electronic devices, such as those utilized in power systems, communications, industrial automation, and computing. The product has a built-in thermal resistance that helps to efficiently dissipate the heat generated from the device while also providing a solution to the issue of heat management. The product is designed to provide optimal heat management for the device, and it is also relatively efficient in its operation. By providing a reliable, efficient cooling solution, the APR33-33-21CB/A01 is effective in maintaining the performance of the electronic device.
The APR33-33-21CB/A01 features a unique design that allows it to be installed into the device’s internal components. It features a series of interlocking fins that are designed to dissipate heat more quickly and effectively than standard heat sinks. This heat sink also features holes, which allow for the air inside the device to flow better and help keep the temperature down. Additionally, the APR33-33-21CB/A01 has a unique design that is intended to fit in the device’s enclosure.
The working principle of the APR33-33-21CB/A01 is based on the concept of convection cooling, which relies on the transfer of thermal energy from one body to another through the air. The heat sink is placed in the device’s enclosure and is connected to a series of vents that allow air to flow through the enclosure and over the heat sink. As the air passes over the fins, it absorbs the thermal energy, which is then dissipated from the device. As the air travels within the device’s enclosure, it also promotes a better cooling of the device’s internal components.
The APR33-33-21CB/A01 is designed to provide a cost-effective, reliable cooling solution to help ensure that the device operates efficiently and reliably. The product is easy to install and can be used with a variety of different components, making it an ideal heat sink for many different applications. Furthermore, the APR33-33-21CB/A01 is designed to be durable, making it a worthwhile investment for any electronic device.
In conclusion, the APR33-33-21CB/A01 is a reliable, cost-effective heat sink that is used to increase the efficiency of a variety of electronic devices. It features an efficient design that allows for efficient heat transfer from the device to the surrounding environment. The product is easy to install and is designed to provide a reliable cooling solution to ensure that the device operates efficiently and reliably. The APR33-33-21CB/A01 is an ideal solution for any application that requires efficient heat management.
The specific data is subject to PDF, and the above content is for reference
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