APR38-38-21CB/A01 Allicdata Electronics
Allicdata Part #:

APR38-38-21CB/A01-ND

Manufacturer Part#:

APR38-38-21CB/A01

Price: $ 5.10
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR38-38-21CB/A01 datasheetAPR38-38-21CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 4.59068
Stock 1000Can Ship Immediately
$ 5.1
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.476" (37.50mm)
Width: 1.476" (37.50mm)
Diameter: --
Height Off Base (Height of Fin): 0.811" (20.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.41°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.13°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are designed to dissipate heat away from an electronic component or other heat-producing device. Heat sinks are commonly used on computer motherboards, central processing units, desktop computers, graphics cards and other electrical components. The APR38-38-21CB/A01 is a type of heat sink designed for use in a variety of applications and it is capable of dissipating heat in a wide temperature range.

The APR38-38-21CB/A01 is a highly modern heat sink that comes equipped with the latest thermal technology. It uses an all-metal core and a unique three-dimensional fins design to provide excellent cooling to any device requiring thermal management. The thermal fins are designed to maximize heat dissipation so that heat can be quickly removed from the device. The heat sink also uses a unique internal air flow, which helps to keep the temperature of the device under control.

The installation process of the APR38-38-21CB/A01 is relatively simple and easy. It can be mounted onto a motherboard or other similar device with the use of mounting clips. The heat sink is also easy to clean and maintain, as it is designed to be self-cleaning by keeping the dust and debris away from the device. Once installed, the device should provide excellent performance and durability in a variety of applications, including consumer electronics, industrial, automotive, and computer systems.

The APR38-38-21CB/A01 features an aerodynamic design which increases the airflow around the device and helps to reduce the amount of heat that is generated by the device. This helps to keep the overall temperature of the device low, which in turn helps to reduce the risk of overheating and burning up of components. The thermal resistance is also improved by using a three-dimensional fin design, which helps to reduce the amount of air trapped inside the device.

The APR38-38-21CB/A01 is a highly efficient and reliable heat sink that can be used in a variety of applications. The device is capable of providing excellent thermal management and cooling properties in a wide range of temperatures. The simple installation and low-maintenance design makes it an ideal choice for all types of electronic systems. With its robust design and advanced thermal technology, the APR38-38-21CB/A01 is an excellent choice for anyone looking for a reliable and efficient heat sink.

The specific data is subject to PDF, and the above content is for reference

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