APR33-33-12CB/M Allicdata Electronics
Allicdata Part #:

294-1133-ND

Manufacturer Part#:

APR33-33-12CB/M

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED WITH MEDIUM CLIP
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR33-33-12CB/M datasheetAPR33-33-12CB/M Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Clip
Shape: Square, Pin Fins
Length: 1.283" (32.60mm)
Width: 1.283" (32.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks encompass a wide variety of applications and technologies, ranging from simple-to-install residential cooling systems to complex industrial facilities. The APR33-33-12CB/M Heat Sink is one such technology that is designed to efficiently dissipate heat from heated components, such as CPUs and other semico nductors, through a heat-dissipating surface.

The APR33-33-12CB/M Heat Sink is designed around a rectangular base heat sink, usually made of aluminum, which is linked to two small heat sinks connected in series. This allows for the transfer of heat from the component to be dissipated into the two smaller fins. The fins are also designed to increase the surface area of the heat sink to increase its efficiency. The smaller fins are often composed of copper or aluminum alloys, which can better absorb and disburse the heat away from the component.

The design of the APR33-33-12CB/M Heat Sink also includes a cooling fan, and usually a heat-dissipating thermal grease applied to the component before installation. This will help to improve the overall thermal dissipation, as the fan will draw air through the heat sink, allowing the higher temperature air to escape while the cooler air passes over the fins and takes the heat away. With this method, the heat sink can provide a much greater cooling capacity for smaller components.

The working principle of the APR33-33-12CB/M Heat Sink is quite simple; hot air is drawn into the cooling fan, and passes over the heatsink. The heat is then transferred into the heatsink and dispersed through the fins, which are designed to enhance the dissipation of heat away from the component. The cooler air that passes through the heatsink is then expelled out of the other side of the fan.

The APR33-33-12CB/M Heat Sink is an example of a simple and efficient thermal dissipation technology that can be used with many components. The efficient design and cooling fan allow for rapid disbursement of heat, making it an ideal solution for many applications. By using the APR33-33-12CB/M Heat Sink in residential and industrial facilities, the component’s temperature can be kept at a safe operating temperature without the need for additional fans or cooling systems.

The specific data is subject to PDF, and the above content is for reference

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