APR35-35-12CB Allicdata Electronics
Allicdata Part #:

APR35-35-12CB-ND

Manufacturer Part#:

APR35-35-12CB

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED 35X35X12MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR35-35-12CB datasheetAPR35-35-12CB Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Pin Fins
Length: 1.366" (34.70mm)
Width: 1.366" (34.70mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a key factor for the reliability and performance of any electronic device. Heat sinks provide the physical means to transfer heat away from components, and are very important for the overall cooling efficiency of a system. The APR35-35-12CB heat sink is a popular heat sink designed for a wide range of applications and is able to effectively transfer heat away from components. In this article we will look at the application field and working principle of the APR35-35-12CB heat sink.

The APR35-35-12CB heat sink is a compact and lightweight heat sink that can be used in computers, servers and other electronic devices. It has a unique design that incorporates features such as a heatsink base with aluminum fins, optimized air flow and an integrated air deflector. The APR35-35-12CB heat sink is designed to be used in a variety of systems, from single-board computers to high-end servers. It is also designed for easy installation and can be quickly installed into any system.

The working principle of the APR35-35-12CB heat sink involves two basic processes: conduction and convection. The heat sink has an aluminum baseplate which creates an efficient thermal interface between the component and the heat sink. This helps to conduct the heat away from the component and into the heat sink. Once the heat is in the heat sink, it is then dissipated via convection. The aluminum fins on the heat sink create an air tunnel which allows air to pass over the heat sink and absorb the heat from the fins, thus cooling the heat sink.

The APR35-35-12CB heat sink is a popular choice for a wide range of electronic devices and systems. It is designed to provide efficient heat transfer in a space-saving, lightweight package, and is also an affordable solution for those on a budget. The APR35-35-12CB heat sink is also extremely reliable and can be used in even the most demanding environments.

The APR35-35-12CB heat sink is a great choice for thermal management, providing an efficient and reliable way to transfer heat away from components. It is a widely used heat sink for computers, servers and other electronic devices, and is designed to be easy to install. The APR35-35-12CB heat sink is also an affordable option for those on a budget.

The specific data is subject to PDF, and the above content is for reference

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