APR38-38-12CB/S

Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Clip
Shape:	Square, Pin Fins
Length:	1.461" (37.10mm)
Width:	1.461" (37.10mm)
Diameter:	--
Height Off Base (Height of Fin):	0.457" (11.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.30°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks - APR38-38-12CB/S Application Field and Working Principle

Thermal - heat sinks are an essential component of modern electronics used in the mitigation of rising temperatures and the prevention of thermal overloads. The type of thermal - heat sink used for a particular application is determined mainly by the application field, the cooling requirements, and the cost. In this article, we will discuss the application field and working principle of the thermal - heat sink type known as APR38-38-12CB/S. APR38-38-12CB/S thermal - heat sinks are designed to dissipate heat generated by power electronics in a variety of electronic applications. Common applications for APR38-38-12CB/S thermal - heat sinks include high-temperature resistors, semiconductors, and other similar components found in electronic devices such as computers, medical devices, and wireless communication systems. The APR38-38-12CB/S thermal - heat sink is also used in industrial and domestic electronic appliances, automotive cooling systems, and in air conditioning and refrigeration systems.The working principle of APR38-38-12CB/S thermal - heat sink is based on the principle of reducing heat transfer from a device to its surroundings by increasing the surface area available for heat transfers. The heat sink utilizes a combination of fins and flat surfaces in order to increase the surface area. A process of conduction takes place when a heat sink absorbs the heat from the electronic device and then radiates it into the surrounding environment.Due to its superior thermal performance, the APR38-38-12CB/S thermal - heat sink is often used in applications that require high levels of thermal performance. This type of heat sink is made of extruded copper or aluminum for maximum efficiency. Its heat dissipating fins can be designed to maximize airflow for maximum cooling performance. Furthermore, the APR38-38-12CB/S has been designed with a low profile, meaning that it takes up less board area, making it ideal for applications where space is a premium.To further maximize its thermal performance, the APR38-38-12CB/S heat sink is also commonly sold with oversized metal heat spreaders. These heat spreaders help to reduce the temperature of hot spots and minimize the overall temperature of the heat sink. Additionally, the heat sink can be customized with adapters to fit into almost any application, including deeply seated components.In summary, the APR38-38-12CB/S thermal - heat sink is designed for a wide range of applications, with superior thermal performance and easy installation. It is made of high-quality extruded copper or aluminum and features a low-profile design, making it ideal for applications where space is a premium. It also has oversized metal heat spreaders to improve its thermal performance, and it can be easily customized to fit into any application.

The specific data is subject to PDF, and the above content is for reference

Part Number	Manufacturer	Price	Quantity	Description