APR35-35-18CB/A01

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are a kind of passive thermal management devices applied to electronic elements such as microprocessors, power transistors, and other components to help them dissipate heat in order to effectively improve and maintain their performance and lifespan. With the development of electronic systems, the need for effective thermal management solutions has become increasingly more important and therefore, heat sinks have become a vital element in high-end electronic applications.

The APR35-35-18CB/A01 is one such heat sink and it is renowned for its superior thermal performance. Its design consists of a rectangular-shaped aluminum body with an anodized finish, a heat spreader on the base and a continuous finning design, providing excellent heat dissipation. The APR35-35-18CB/A01 is an effective thermal management device suitable for a variety of applications.

The APR35-35-18CB/A01 is especially designed for use in applications requiring high thermal conductivity and heat dissipation, such as those found in personal computers.Because of its large surface area, the APR35-35-18CB/A01 can effectively transfer heat away from the CPU, minimizing the risk of component overheating. It also ensures that CPU and other components remain at their optimal temperature, which can significantly improve system performance.

In addition to providing superior cooling performance, the APR35-35-18CB/A01 also gives users flexibility in terms of installation options. The heat sink is easily mounted on most motherboards thanks to its universal mounting holes. With its quick-release design, mounting and dismounting are fast and easy, saving time and effort.

The APR35-35-18CB/A01is designed with a two-piece construction and features quality aluminum alloy for superior heat dissipation. The design also includes channels for air to circulate between the fins and the heat spreader. The air flow is enhanced by a powerful fan, which is integrated into the heat spreader, creating additional air circulation throughout the heat sink. This allows the entire system to remain cool, preventing any parts from overheating.

The APR35-35-18CB/A01 is designed with a number of advanced features, including a built-in temperature sensor, customizable thermal thresholds, and a thermal memory bank. The temperature sensor measures the temperature of the CPU and can be adjusted to a custom threshold, ensuring that the CPU receives the optimal amount of cooling. The thermal memory bank stores the temperature readings and can be accessed by a user to monitor the system’s performance.

In conclusion, the APR 35-35-18CB/A01 is an effective thermal management device suitable for use in high-performance electronic applications. Its advanced design features allow for superior heat dissipation while its installation options provide users the flexibility they need. With its temperature sensor and thermal memory bank, users can enjoy increased protection and performance from the components in their systems.

The specific data is subject to PDF, and the above content is for reference