APR31-31-28CB/A01 Allicdata Electronics
Allicdata Part #:

APR31-31-28CB/A01-ND

Manufacturer Part#:

APR31-31-28CB/A01

Price: $ 5.31
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR31-31-28CB/A01 datasheetAPR31-31-28CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 4.78252
Stock 1000Can Ship Immediately
$ 5.31
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.205" (30.61mm)
Width: 1.205" (30.61mm)
Diameter: --
Height Off Base (Height of Fin): 1.087" (27.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.52°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.87°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Thermal - Heat Sinks are designed to remove heat from components and maintain proper operating temperatures. The APR31-31-28CB/A01 is a Thermotile thermal heat sink which controls its thermal heat dissipation through air-cooled cooling fans. It is an efficient, low-profile, ultra-low profile, cost-effective solution for high-end server applications, including datacenter storage, high performance computing, and industrial computing.

The APR31-31-28CB/A01 is designed to mount vertically on a server chassis using an optional PCI bracket system. It utilizes a patented agile cooling system that utilizes a compact and flexible fan module to create a localized air stream that can be used to evenly distribute the air-flow and minimize hot spots. The fan module also allows for a wide range of thermal capabilities, with optional RPM speeds to match the cooling requirements of the system. The passive heatsink design features a large aluminum fin array that is set at an optimal distance to ensure a balanced air velocity.

The APR31-31-28CB/A01 thermalheat sink features a copper heat spreader which helps to dissipate heat from the surface by increasing the surface area. The sink also incorporates a number of unique features which help to enhance heat dissipation and reduce noise. The thermal interface material (TIM) uses thermally conductive carbon pads which are positioned to reduce air gap between the aluminum fins and the copper heat spreader. The heat sink also includes a central cavity which helps to pull air into the fins for improved heat transfer. The shape of the fins is designed to reduce turbulence and increase airflow, while the profile of the walls is optimized for low noise effect when the fan is running.

The APR31-31-28CB/A01 is designed for medium to high-power applications ranging from storage to performance computing. The thermal heat sink is easy to install and provides a reliable cooling solution for improved system performance. It is designed for use in server chassis, including high-end systems with high-load computing needs. It has an impressive heat dissipation range of 0-150 W and can provide a quiet and efficient fan noise of 25.3 dBA.

The APR31-31-28CB/A01 thermal heat sink is an excellent choice for a wide range of applications where heat and noise management are key considerations. Its patented agile cooling system and robust design helps to ensure reliable and efficient heat removal. It is a cost-effective solution for high-end server applications which require a high degree of thermal control and noise reduction. With its superior performance and energy efficiency, it makes an ideal cooling solution for datacenters.

The specific data is subject to PDF, and the above content is for reference

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