APR33-33-12CB/A01 Allicdata Electronics
Allicdata Part #:

294-1131-ND

Manufacturer Part#:

APR33-33-12CB/A01

Price: $ 4.45
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED W/THERMAL TAPE
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR33-33-12CB/A01 datasheetAPR33-33-12CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 4.00176
Stock 1000Can Ship Immediately
$ 4.45
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.283" (32.60mm)
Width: 1.283" (32.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks offer a very wide range of uses, from phase change cooling to reducing the heat generated in electrical applications. Most commonly, heat sinks are used to reduce the temperature of a component or system, as well as providing thermal insulation or removal components. One of the most popular and widely used type of heat sink products is the APR33-33-12CB/A01, which is commonly considered a hardy general purpose heat sink.

The APR33-33-12CB/A01is a particular type of heat sink, manufactured by Kesterlet Corporation. It is constructed of aluminum, and features wide fin spacing. This heat sink has a general purpose design. It can be applied in anything from desktop computer cases to automobile cooling systems, and is especially well suited for larger scale applications.Typically, these heat sinks are used to reduce the heat of a certain component or system by taking away some of the heat energy from the item being cooled.

The APR33-33-12CB/A01 heat sink has an effective area of 1,533 square centimeters, and heat transfer of 40 watts. It has a low profile design, making it relatively lightweight. Its layout features a collection of small fins which act as a type of cooling by transferring and dissipating heat away from the components or systems they are attached to. This feature allows for the transfer of more heat energy from the component or system.

The APR33-33-12CB/A01 heat sink is designed to meet a broad range of thermal use cases. This heat sink already has universal mounting options and patterns to facilitate ease of installation into different types of systems. It also has a high stiffness and resistance to torsional stress, a high resistance to corrosion and vibration fatigue. The heat sink also features a strong heat-dissipation capacity. Additionally, the heat sinks\' fins feature high thermal conductivity, even in difficult thermal enclosures.

The APR33-33-12CB/A01 heat sink is an ideal solution for many applications and cooling needs. It is an extremely versatile product that can be easily incorporated into systems of many types. Additionally, the heat sink features a low profile design, which makes it ideal for use in areas where space is at a premium. The heat sink also offers excellent performance, with reduced thermal resistance, improved cooling efficiency, and a low Thermal interface material (TIM) requirement.

In conclusion, the APR33-33-12CB/A01 heat sink is an ideal choice for heat sink applications due to its general purpose design, excellent performance, and universal mounting options. It is an excellent solution for systems that require efficient thermal management. The flexibility and usage of this particular type of heat sink make it a great addition to any thermal management system.

The specific data is subject to PDF, and the above content is for reference

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