FDFMA3P029Z Allicdata Electronics

FDFMA3P029Z Discrete Semiconductor Products

Allicdata Part #:

FDFMA3P029ZCT-ND

Manufacturer Part#:

FDFMA3P029Z

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: ON Semiconductor
Short Description: MOSFET P CH 30V 3.3A MICRO 2X2
More Detail: P-Channel 30V 3.3A (Ta) 1.4W (Ta) Surface Mount 6-...
DataSheet: FDFMA3P029Z datasheetFDFMA3P029Z Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Vgs(th) (Max) @ Id: 3V @ 250µA
Package / Case: 6-VDFN Exposed Pad
Supplier Device Package: 6-MicroFET (2x2)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 1.4W (Ta)
FET Feature: Schottky Diode (Isolated)
Input Capacitance (Ciss) (Max) @ Vds: 435pF @ 15V
Vgs (Max): ±25V
Gate Charge (Qg) (Max) @ Vgs: 10nC @ 10V
Series: PowerTrench®
Rds On (Max) @ Id, Vgs: 87 mOhm @ 3.3A, 10V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Current - Continuous Drain (Id) @ 25°C: 3.3A (Ta)
Drain to Source Voltage (Vdss): 30V
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Part Status: Discontinued at Digi-Key
Packaging: Cut Tape (CT) 
Description

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The FDFMA3P029Z is a field effect transistor (FET). It is a single, metal-oxide-semiconductor FET (MOSFET). This type of transistor is used for many applications and is characterized by a stable, linear transfer of current over a wide range of voltages and temperature.

The FDFMA3P029Z is manufactured using a semiconductor process, wherein a thin-film layer of metal is deposited onto a semiconductor substrate. This layer of metal is generally oxygen doped or nitride doped, making it conductive and forming the channel through which charge carriers must flow.

The FDFMA3P029Z has a number of unique properties that make it well-suited to applications requiring low-noise, high-reversal level operation. It is particularly useful in high-current and high-voltage applications, withstanding up to +/-20V.

In a typical FDFMA3P029Z application, the metal-oxide-semiconductor FET is used as a switching transistor. In these applications, the metal oxide layer acts as an insulator, preventing current from passing through the semiconductor substrate unless an appropriate amount of voltage is applied to the gate. The resistance of the channel is controlled by the voltage applied to the gate, meaning that either a large or small current can be passed through the channel depending on the amount of voltage applied.

The FDFMA3P029Z is also used in power management applications, where it is used as a P-channel MOSFET. In this type of application, the transistor behaves as a variable resistor, adjusting the flow of current through the device according to gate voltage. This makes it useful for controlling the voltage and current to other parts of the circuit.

Finally, the FDFMA3P029Z is also commonly used as an output element in digital logic circuits. In these types of applications, the transistor is used as a logic gate, allowing current to pass through when the voltage at the gate is high, and preventing current from passing through when the gate voltage is low.

In summary, the FDFMA3P029Z is a single, metal-oxide-semiconductor FET which is used for many applications and is characterized by a stable, linear transfer of current over a wide range of voltages and temperature. It is most commonly used as a switching transistor, a power management device and as an output element in digital logic circuits.

The specific data is subject to PDF, and the above content is for reference

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