
Allicdata Part #: | MT29E4T08EYHBBG9-3:B-ND |
Manufacturer Part#: |
MT29E4T08EYHBBG9-3:B |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Micron Technology Inc. |
Short Description: | IC FLASH 4T PARALLEL 333MHZ |
More Detail: | FLASH - NAND Memory IC 4Tb (512G x 8) Parallel 333... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Active |
Memory Type: | Non-Volatile |
Memory Format: | FLASH |
Technology: | FLASH - NAND |
Memory Size: | 4Tb (512G x 8) |
Clock Frequency: | 333MHz |
Write Cycle Time - Word, Page: | -- |
Memory Interface: | Parallel |
Voltage - Supply: | 2.5 V ~ 3.6 V |
Operating Temperature: | 0°C ~ 70°C (TA) |
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MT29E4T08EYHBBG9-3:B Application Field and Working Principle
MT29E4T08EYHBBG9-3:B is a type of flash memory product produced by Micron Technology. This Flash is a triple-level cell, or a 3D NAND Flash memory solution. The technology has some significant advantages over the existing single-level cell (SLC) and multi-level cell (MLC) NAND Flash devices. It offers higher levels of reliability and endurance, as well as significantly reduced power consumption. It also has the potential to reduce the cost of solid state drive (SSD) storage solutions, making this type of memory applicable for a wide range of applications.
MT29E4T08EYHBBG9-3:B is a product of a new three-dimensional NAND, or 3D NAND, memory architecture developed by Intel, Microsoft and Micron. This technology enables higher levels of data density and reliability as well as reduced power consumption compared to 2D NAND. The product utilizes Micron\'s proprietary Charge Trap Flash (CTF) cell technology, which uses a thin electrical insulation layer on the memory chip to store data and enable multiple charge levels to be stored.
This product is widely applied to the field of SSD storage solutions, as it provides an improved endurance, higher levels of data density and lower power consumption. These features make it ideal for applications such as enterprise storage systems, high-performance storage, embedded applications and embedded flash products. By providing a more reliable and cost-effective storage solution, it can help businesses to reduce their total cost of ownership (TCO) and making flash memory more affordable for many organizations.
The working principle behind the technology is simple. The CTF cell stores data in the form of electrical charges that are trapped between a thin electrical insulating layer on the memory chip. When the electrons are released, they must pass through the charge trapping layer. As the electrons travel, their energy is released as light and detected on a single light-sensitive sensing pixel. By counting the number of electrons as they pass through, the CTF technology is able to accurately detect and store the data in a way that can be retrieved quickly and reliably.
MT29E4T08EYHBBG9-3:B offers improved levels of performance, data density and lower power consumption compared to SLC and MLC NAND Flash devices. Its power consumption and endurance are significantly lower than conventional NAND Flash solutions. In summary, MT29E4T08EYHBBG9-3:B is an ideal choice for applications where high levels of data density and reliability are demanded. It is also an attractive solution for cost conscious organizations that need to significantly reduce their overall storage costs.
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