MT29F4G16AACWC-ET:C TR Allicdata Electronics

MT29F4G16AACWC-ET:C TR Integrated Circuits (ICs)

Allicdata Part #:

557-1368-2-ND

Manufacturer Part#:

MT29F4G16AACWC-ET:C TR

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: IC FLASH 4G PARALLEL 48TSOP
More Detail: FLASH - NAND Memory IC 4Gb (256M x 16) Parallel ...
DataSheet: MT29F4G16AACWC-ET:C TR datasheetMT29F4G16AACWC-ET:C TR Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tape & Reel (TR) 
Part Status: Obsolete
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NAND
Memory Size: 4Gb (256M x 16)
Write Cycle Time - Word, Page: --
Memory Interface: Parallel
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TSOP
Supplier Device Package: 48-TSOP
Base Part Number: MT29F4G16
Description

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Memory devices play a crucial role in data storage, allowing quick access to frequently used information and allowing for the long-term storage of data digitally. Memory devices come in many forms, one of which is the MT29F4G16AACWC-ET:C TR. It is a non-volatile memory, meaning that it can hold its data even when the system or device it is connected to is turned off. This type of memory device is commonly used in embedded systems and is an ideal choice for applications that require high performance and endurance.

The MT29F4G16AACWC-ET:C TR is an 8-Gigabit (1-Gigabyte) multi-level cell (MLC) NAND flash memory device. It is a MLC type device, meaning that it stores three bits of information in each cell, allowing for a significantly larger storage capacity in comparison to single-level cell (SLC) NAND flash memory. Furthermore, the MT29F4G16AACWC-ET:C TR features a hardware-implemented algorithm that enables the device to detect, diagnose and repair errors that may occur in memory cells, allowing for higher reliability and endurance.

The MT29F4G16AACWC-ET:C TR is available in an 8-pin TSOP package, providing a simple and small form factor for embedded systems. The device has a wide operating temperature range of -25°C to 85°C and requires a 1.8V operating voltage. The MT29F4G16AACWC-ET:C TR has a random access time of 75ns and a sequential read time of 16µs. It also features a 4KB page size, allowing for a flexible data organization.

The MT29F4G16AACWC-ET:C TR is a commonly used memory device in embedded systems, thanks to its small form factor, wide operating temperature range and high performance. It is often used as an ideal choice in applications that require high endurance and reliability. It is also frequently used for data logging, code storage and for data programs.

The working principle of the MT29F4G16AACWC-ET:C TR is based on the concept of multi-level cell storage. In this type of storage, information is stored in multiple memory cells, each of which has a different charge potential that denotes a different value, such as a 0 or 1. To store data in this type of device, the charge potential of each memory cell is adjusted until it reaches a certain pre-defined voltage level, which corresponds to one of the possible values, such as 0 or 1. To read the stored data, the charge potential of each memory cell is then measured and the corresponding value is then determined.

The MT29F4G16AACWC-ET:C TR uses a hardware-implemented algorithm to detect, diagnose and repair data errors. The device employs an error-correcting code (ECC) algorithm to detect multiple errors in memory cells, identify the faulty memory cell and to repair the errors by rewriting the faulty memory cells. The device also employs static and dynamic wear-leveling algorithms to reduce the wear on the device\'s memory cells and increase the device\'s endurance.

The MT29F4G16AACWC-ET:C TR is an ideal choice for applications that require high performance, endurance and reliability. Its small form factor, wide operating temperature range and error-correcting code algorithm make it an ideal choice for embedded systems. Its multi-level cell storage capability allows for larger storage capacities and its wear-leveling algorithms allow for increased endurance and reliability.

The specific data is subject to PDF, and the above content is for reference

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