NAND01GW3B2AN6E Allicdata Electronics
Allicdata Part #:

497-4617-ND

Manufacturer Part#:

NAND01GW3B2AN6E

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: STMicroelectronics
Short Description: IC FLASH 1G PARALLEL 48TSOP
More Detail: FLASH - NAND Memory IC 1Gb (128M x 8) Parallel 30...
DataSheet: NAND01GW3B2AN6E datasheetNAND01GW3B2AN6E Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: --
Packaging: Tray 
Part Status: Obsolete
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NAND
Memory Size: 1Gb (128M x 8)
Write Cycle Time - Word, Page: 30ns
Access Time: 30ns
Memory Interface: Parallel
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package: 48-TSOP
Base Part Number: NAND01G
Description

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NAND01GW3B2AN6E is a kind of memory storage device developed and produced by Micron Technology Inc. It has a wide range of applications in the fields of storage and data transmission, computer systems and industrial products. This device is usually connected to a controller, and generally consists of a controller, a memory array, a memory interface and a power supply. It is suitable for use in embedded systems and other related fields.

The NAND01GW3B2AN6E memory device has a memory array size of 32 megabytes (MB) and supports a variety of nonvolatile block programming operations. It has a wide operating voltage range and can support multiple types of programming operations including read, write, erase, refresh, program/erase suspend and multi-byte operation. It has been designed for maximum reliability and durability in harsh environment use. The memory device supports data retention for more than ten years, and the data stored on it will not be lost due to power supply failure. It can also support high speed read and write operations with a transfer rate of up to 75MB/s.

The working principle of the NAND01GW3B2AN6E memory device is based on the NAND flash memory design. In this design, the memory device uses a multi-plane architecture to achieve a reduction in the size of the memory array without sacrificing the performance. Each plane consists of several blocks, and each block consists of a cell array. The cells are used to store data, and when the memory device is powered on, the cells are read or written to and from the memory device.

In addition, the NAND01GW3B2AN6E memory device also supports Error Correction Code (ECC) to ensure the accuracy and reliability of the stored data. The ECC process is managed by the controller, which can detect and correct any errors in the data stored on the device. The combination of the multi-plane architecture and the ECC allows the memory device to offer higher data access speed, reliability and efficiency than single-level architecture memory devices.

The NAND01GW3B2AN6E memory device is widely used in embedded systems due to its features such as high performance, reliability, low power consumption and compact size. It can be found in many products such as digital cameras, PDAs, GPS navigation systems, and automotive infotainment systems. It is also widely used in industrial products such as industrial automation systems and RFID tags.

In conclusion, the NAND01GW3B2AN6E memory device is an ideal solution for a wide range of applications due to its features and its wide operating voltage range. It offers high performance, high data transfer rate, high reliability and long data retention. Its compact size and low power consumption make it suitable for embedded systems and other related fields.

The specific data is subject to PDF, and the above content is for reference

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