Nxp lighting controller - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MC908GR48AMFJE- ND	MC908GR48AMFJE	NXP USA Inc	View more Series: HC08 Packaging: Tray Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 24x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7) Base Part Number: MC908GR48	1000 Order	1+: $0
FRDM-STBC-SA950 0-ND	FRDM-STBC-SA950 0	NXP USA Inc	View more Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Sensor Type: Accelerometer, 3 Axis Moisture Sensitivity Level (MSL): 1 (Unlimited) Sensing Range: 2g, 4g, 8g Interface: IC, SPI Sensitivity: 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB Voltage - Supply: 1.71 V ~ 1.89 V Embedded: Yes, MCU, 32-Bit Supplied Contents: Board(s) Utilized IC / Part: FXLC95000CL	10 Order	1+: $22.7556
568-3043-5-ND	74LVT534D,112	NXP USA Inc	View more Series: 74LVT Packaging: Tube Part Status: Obsolete Function: Standard Type: D-Type Output Type: Tri-State, Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 150MHz Max Propagation Delay @ V, Max CL: 4.9ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Iq): 190A Input Capacitance: 4pF Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Base Part Number: 74LVT534	1000 Order	1+: $0
568-2986-5-ND	74LV574N,112	NXP USA Inc	View more Series: 74LV Packaging: Tube Part Status: Obsolete Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 70MHz Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 16mA, 16mA Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Iq): 20A Input Capacitance: 3.5pF Operating Temperature: -40C ~ 125C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Base Part Number: 74LV574	1000 Order	1+: $0
568-14584-ND	MCZ33903CS5EK	NXP USA Inc	View more Packaging: Tube Part Status: Last Time Buy Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount Base Part Number: MCZ33903	42 Order	1+: $4.1328 10+: $3.7346 100+: $3.092 500+: $2.6925 1000+: $2.3451
568-9816-2-ND	PCA9517ATP,147	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Type: Buffer, ReDriver Applications: IC Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 2 Capacitance - Input: 6pF Voltage - Supply: 2.7 V ~ 5.5 V Current - Supply: 5mA Operating Temperature: -40C ~ 85C Package / Case: 8-WFDFN Exposed Pad Supplier Device Package: 8-HWSON (2x3) Base Part Number: PCA9517A	12000 Order	4000+: $0.3741 8000+: $0.3554
LPC1112FDH28/10 2:5-ND	LPC1112FDH28/10 2:5	NXP USA Inc	View more Series: LPC1100L Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: IC, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 22 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP Base Part Number: LPC1112	1000 Order	2500+: $0.6345
S9S08QD2J1CSCR- ND	S9S08QD2J1CSCR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 16MHz Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	1000 Order	--
LPC1114FHN33/30 3Y-ND	LPC1114FHN33/30 3Y	NXP USA Inc	View more Series: LPC1100L Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: IC, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	1000 Order	4000+: $0.8798
MCHC908QY2CDWER -ND	MCHC908QY2CDWER	NXP USA Inc	View more Series: HC08 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC Base Part Number: MCHC908QY2	1000 Order	1000+: $1.3997
S9KEAZ64ACLK-ND	S9KEAZ64ACLK	NXP USA Inc	View more Series: Kinetis KEA Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, IC, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 71 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	1000 Order	450+: $1.7249
S9S08AW32E5MPUE -ND	S9S08AW32E5MPUE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active	1000 Order	--
S9S12G192F0VLF- ND	S9S12G192F0VLF	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: S9S12G192	1000 Order	--
S912ZVFP64F1CLL -ND	S912ZVFP64F1CLL	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 78 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: S912ZVFP64	1000 Order	450+: $3.1916
S9S08DZ32F2CLH- ND	S9S08DZ32F2CLH	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: S9S08DZ32	1000 Order	800+: $3.2322
MC9S08DV32AMLFR -ND	MC9S08DV32AMLFR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	1000 Order	2000+: $3.324
MK30DX64VMC7-ND	MK30DX64VMC7	NXP USA Inc	View more Series: Kinetis K30 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, IC, IrDA, SPI, UART/USART Peripherals: DMA, IS, LCD, LVD, POR, PWM, WDT Number of I/O: 74 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 38x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8) Base Part Number: MK30DX64	1000 Order	348+: $3.5022
MK22DN512VDC5R- ND	MK22DN512VDC5R	NXP USA Inc	View more Series: Kinetis K20 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: IC, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 121-VFBGA Supplier Device Package: 121-MAPBGA (8x8)	1000 Order	2000+: $3.6281
FS32K144UAT0VMH T-ND	FS32K144UAT0VMH T	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	880+: $4.3357
SPC5602BF2VLH4R -ND	SPC5602BF2VLH4R	NXP USA Inc	View more Series: MPC56xx Qorivva Packaging: Tape & Reel (TR) Part Status: Active Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	1500+: $4.5833
MCF51AG128CLK-N D	MCF51AG128CLK	NXP USA Inc	View more Series: MCF51AG Packaging: Tray Part Status: Active Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: IC, SCI, SPI Peripherals: DMA, LVD, PWM, WDT Number of I/O: 69 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14) Base Part Number: MCF51AG128	1000 Order	90+: $4.8302
MC908AP64ACFBER -ND	MC908AP64ACFBER	NXP USA Inc	View more Series: HC08 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: IC, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Number of I/O: 32 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10) Base Part Number: MC908AP64	1000 Order	750+: $5.2216
MK20DN512ZVLQ10 R-ND	MK20DN512ZVLQ10 R	NXP USA Inc	View more Series: Kinetis K20 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 42x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: MK20DN512	1000 Order	500+: $5.3805
MC9S08DZ96MLH-N D	MC9S08DZ96MLH	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: MC9S08DZ96	1000 Order	160+: $5.4276
MK52DN512ZCLQ10 -ND	MK52DN512ZCLQ10	NXP USA Inc	View more Series: Kinetis K50 Packaging: Tray Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: EBI/EMI, Ethernet, IC, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 96 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 41x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: MK52DN512	1000 Order	300+: $6.523
LPC43S70FET256E -ND	LPC43S70FET256E	NXP USA Inc	View more Series: LPC43xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CANbus, EBI/EMI, Ethernet, IC, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, IS, LCD, POR, PWM, WDT Number of I/O: 164 Program Memory Type: ROMless RAM Size: 282K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 3x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17)	1000 Order	90+: $6.7855
S9S12D64F0CFUE- ND	S9S12D64F0CFUE	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Not For New Designs Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: PWM, WDT Number of I/O: 59 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14) Base Part Number: S9S12D64	1000 Order	420+: $8.3296
S912XET512BMAGR -ND	S912XET512BMAGR	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	500+: $8.5961
SPC561MVR56D-ND	SPC561MVR56D	NXP USA Inc	View more Series: MPC5xx Packaging: Tray Part Status: Not For New Designs Core Processor: PowerPC Core Size: 32-Bit Speed: 56MHz Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 64 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27) Base Part Number: SPC561	1000 Order	200+: $25.4958
AFT18H357-24NR6 -ND	AFT18H357-24NR6	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: LDMOS (Dual) Frequency: 1.81GHz Gain: 17.5dB Voltage - Test: 28V Current - Test: 800mA Power - Output: 63W Voltage - Rated: 65V Package / Case: OM-1230-4L2L Supplier Device Package: OM-1230-4L2L	1000 Order	150+: $73.7954
A2T18S260W12NR3 -ND	A2T18S260W12NR3	NXP USA Inc	View more Part Status: Active Transistor Type: LDMOS Frequency: 1.805GHz ~ 1.88GHz Gain: 18.7dB Voltage - Test: 28V Current Rating: 10A Current - Test: 1.5A Power - Output: 280W Voltage - Rated: 65V Package / Case: OM-880X-2L2L Supplier Device Package: OM-880X-2L2L	1000 Order	250+: $114.845
A2T18H450W19SR6 -ND	A2T18H450W19SR6	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: LDMOS Frequency: 1.805GHz ~ 1.88GHz Gain: 16.5dB Power - Output: 89W Voltage - Rated: 30V Package / Case: NI-1230S-4S4S Supplier Device Package: NI-1230S-4S4S	1000 Order	150+: $129.447
BF998R,235-ND	BF998R,235	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: N-Channel Dual Gate Frequency: 200MHz Voltage - Test: 8V Current Rating: 30mA Noise Figure: 0.6dB Current - Test: 10mA Voltage - Rated: 12V Package / Case: SOT-143R Supplier Device Package: SOT-143R Base Part Number: BF998	1000 Order	1+: $0
MRF19125R5-ND	MRF19125R5	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: LDMOS Frequency: 1.93GHz Gain: 13.5dB Voltage - Test: 26V Current - Test: 1.3A Power - Output: 24W Voltage - Rated: 65V Package / Case: NI-880 Supplier Device Package: NI-880	1000 Order	1+: $0
MRF6S19200HSR5- ND	MRF6S19200HSR5	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: LDMOS Frequency: 1.93GHz ~ 1.99GHz Gain: 17.9dB Voltage - Test: 28V Current - Test: 1.6A Power - Output: 56W Voltage - Rated: 66V Package / Case: NI-780S Supplier Device Package: NI-780S Base Part Number: MRF6S19200	1000 Order	1+: $0
PDTA114YK,115-N D	PDTA114YK,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1): 10 kOhms Resistor - Emitter Base (R2): 47 kOhms DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250A, 5mA Current - Collector Cutoff (Max): 1A Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK Base Part Number: PDTA114	1000 Order	1+: $0
2N3904,412-ND	2N3904,412	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Transistor Type: NPN Current - Collector (Ic) (Max): 200mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V Power - Max: 500mW Frequency - Transition: 300MHz Operating Temperature: 150C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3 Base Part Number: 2N3904	1000 Order	1+: $0
2N5551,116-ND	2N5551,116	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: NPN Current - Collector (Ic) (Max): 300mA Voltage - Collector Emitter Breakdown (Max): 160V Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 10mA, 5V Power - Max: 630mW Frequency - Transition: 300MHz Operating Temperature: 150C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3 Base Part Number: 2N5551	1000 Order	1+: $0
2PB709AS,115-ND	2PB709AS,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: PNP Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 500mV @ 10mA, 100mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 290 @ 2mA, 10V Power - Max: 250mW Frequency - Transition: 80MHz Operating Temperature: 150C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK Base Part Number: 2PB709A	1000 Order	1+: $0
PVR100AD-B12V,1 15-ND	PVR100AD-B12V,1 15	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: NPN + Zener Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Power - Max: 300mW Operating Temperature: 150C (TJ) Mounting Type: Surface Mount Package / Case: SC-74, SOT-457 Supplier Device Package: 6-TSOP Base Part Number: PVR100A	1000 Order	1+: $0

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