This article describes FPGA cross-border acquisition acceleration horizontal integration vertical innovation seeking common ground while retaining differences ...

This article describes how to set parameters of the inverter ...

This article describes the characteristics of the MEMS smart sensor. ...

This article describes the characteristics of the MEMS smart sensor. ...

This article describes the characteristics of the spoke load cells sensor. ...

This article describes the characteristics of the temperature sensor. ...

This article describes the characteristics of the electrochemical sensors. ...

This article describes the characteristics of the nano sensors. ...

This article describes What is consumer electronics and classification and application ...

This article briefly introduces the specific classification of the ATX power supply ...

This article describes the characteristics of the inductor. ...

This article describes the characteristics of the load cell sensors. ...

This article describes the characteristics of the capacitive displacement sensors. ...

This article describes that DSP and MCU are moving toward convergence ...

In the PCBA (Printed Circuit Board Assembly) manufacturing process, surface mount technology and component packaging type are key elements. This article will introduce surface mount technology in PCBA manufacturing, including mounting methods, soldering m ...

In the PCBA (Printed Circuit Board Assembly) assembly process, electrostatic protection and ESD (Electrostatic Discharge) management are crucial. This article will introduce the electrostatic protection principles and ESD management measures in PCBA assem ...

In the PCBA (Printed Circuit Board Assembly) design process, thermal management and heat dissipation technology are crucial. This article will introduce the thermal management principles and common heat dissipation technologies in PCBA design to help read ...

In the PCBA (Printed Circuit Board Assembly) manufacturing process, the application of automation and intelligent technology is gradually changing the traditional production method. This article will discuss the trend of automation and intelligence in PCB ...

PCBA (Printed Circuit Board Assembly) is one of the most important links in the manufacture of electronic products. Soldering technology and process are the key steps in the process of PCBA assembly. This article will introduce the basic principles of sol ...

In the PCBA (Printed Circuit Board Assembly) assembly process, the selection of soldering technology and process is crucial to ensure soldering quality and improve product reliability. This article will introduce the soldering techniques commonly used in ...

In the PCBA (Printed Circuit Board Assembly) manufacturing process, the implementation of environmental protection and sustainable development measures is crucial to reducing environmental impact and improving resource utilization efficiency. This article ...

The PCBA (Printed Circuit Board Assembly) subcontracting labor and material processing mode has been widely used in the electronics manufacturing industry. Due to its advantages of high efficiency, convenience and cost reduction, it has become the mainstr ...

This article writes about the difference between PCB and PCBA ...

This article describes the production of wireless music doorbell ...

This article introduces the preparation of PCB design ...

This article describes the nature and application of monostable flip-flops ...

This article describes the characteristics of the fiber optic sensors. ...

This article describes the method of reducing errors in detecting DC currents. ...

​ This article briefly introduce how to identify and detect electronic components ...

This article describes the characteristics of signal transistor. ...

This article writes about some methods to judge the DC voltage/current block failure of the mechanical multimeter and repair it. ...

This article describes the Dip welding and wave soldering technology ...

The article explores some repair methods after the transformer has been damaged ...

Manual insertion and welding should be first inserted into those components that need to be mechanically fixed,such as the power device radiator,bracket,clip,etc,and then insert the need to weld fixed components. ...

This article describes the layout and wiring of components ...

This article briefly introduces the relationship between the chip and the discrete device ...

This article writes about the electromagnetic interference of LED drive power ...

This article briefly introduces the difference between digital power and analog power ...

This article briefly introduces the Inductor. ...

This article describes the characteristics of the sensors ...