Allicdata Part #: | APR38-38-33CB/A01-ND |
Manufacturer Part#: |
APR38-38-33CB/A01 |
Price: | $ 5.39 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | APR38-38-33CB/A01 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 4.85295 |
Series: | APR |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 1.476" (37.50mm) |
Width: | 1.476" (37.50mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.283" (32.60mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 1.80°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 7.13°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
A thermal heat sink is an essential component of any modern electronic device. The efficiency of a thermal heat sink can only be as good as its design. The APR38-38-33CB/A01 heat sink can be used in many applications with excellent heat dissipation and thermal management ability. This heat sink is a great choice for general purpose thermal management, which provides reliability and cost effectiveness.
APR38-38-33CB/A01 heat sink is designed to provide adequate thermal management for circuits, semiconductors, optoelectronics, and other components with power dissipation in the range of 3W to 10W. The device consists of a machined aluminum plate with several strategically placed some fins along one side. It is mounted in two basic ways: clamped or wired. Clamping the heat sink to a flat surface will provide the most stability and an even thermal output. By wiring the device, it will allow more flexibility in positioning the heat sink and improving its thermal spread.
The working principle of the APR38-38-33CB/A01 heat sink utilizes the expanding air around the device to conduct the internal heat away from the device. This method is efficient and can dissipate the heat away from the device quickly. As the air passes over the fins, the heat is captured and moved to the environment. An increase in fin surface area will result in better thermal performance and heat dissipation.
APR38-38-33CB/A01 heat sink provides effective thermal management solutions and can be used in a variety of applications. It is ideal for use in computers, servers, telecommunications hardware, medical devices, automotive electronics and many other power electronic systems. The device delivers effective thermal transfer and can dissipate heat quickly thanks to the selected material and design. As a result, it provides reliable operation and durability for a wide range of applications.
The APR38-38-33CB/A01 heat sink is a great choice for any application requiring efficient thermal management and is designed to perform in the most demanding environments. The device is an excellent choice for conducting thermal energy away from hot spots and protecting sensitive components from excessive heat damage. This thermal heat sink is one of the most commonly used devices in the industry and is certain to meet the needs of any application.
The specific data is subject to PDF, and the above content is for reference
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