APR33-33-18CB/A01

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an important type of thermal management component that are used to reduce the temperature of electronics, such as microprocessors and heatsinks. The APR33-33-18CB/A01 is a heatsink that is designed to keep the temperature of electronic components at an optimal level. This thermal management device uses a special type of heat pipe technology, which helps to dissipate the heat produced by electronic components quickly and efficiently.

The APR33-33-18CB/A01 heat sink is a high-performance, efficient, and reliable device suitable for many applications. It is designed to accommodate components that generate high heat such as CPUs, FPGAs, GPUs, and GPUs. The APR33-33-18CB/A01 heat sink is designed to facilitate maximum air flow with its specially designed fins to reduce noise, vibration, and power consumption.

The APR33-33-18CB/A01 heat sink is composed of a copper base and an aluminum fin stack. The copper base acts as a heat conductor, transferring thermal energy from the electronic device into the aluminium fin stack. The fins increase the surface area and thus, the rate of heat dissipation. By placing the APR33-33-18CB/A01 heat sink in direct contact with the hot component, the heat is quickly conducted away, thus preventing the component from overheating. The heat generated is then transferred to the air via convection, cooling the component and preventing it from damage due to excessive heat.

The APR33-33-18CB/A01 heat sink features an advanced heat pipe technology. The heat pipe is a special type of thermal management component that consists of a sealed tube filled with heat conducting liquid. When the liquid is heated by the electronic device, the evaporation of the liquid causes the heat to be transferred through the heat pipe and dissipated by the air. This type of thermal management technology is ideal for applications where the heat produced cannot be dissipated through traditional cooling methods such as using fan or air-cooled heatsinks.

The APR33-33-18CB/A01 heat sink is designed to provide excellent performance and reliability. It can handle up to 140W of heat with an airflow of more than 50CFM. It features an anodized surface, which prevents oxidation and corrosion, and allows for smooth and quiet operation. The APR33-33-18CB/A01 also features a precision aluminum insert that offers superior heat conductivity.

The APR33-33-18CB/A01 heat sink is designed for use in a wide range of applications. It can be used in industrial electronics, gaming consoles, gaming PCs, servers, automotive electronics, and other electronic components. It is also suitable for applications that require low power consumption and high thermal conductivity. It is designed to be used in applications where space is limited, and it is capable of providing outstanding performance when used in combination with other thermal management components.

The APR33-33-18CB/A01 thermal management component is a reliable, efficient, and cost-effective thermal management solution. It is designed to provide excellent performance in a wide range of applications, and it is ideal for applications where space is limited or heat needs to be dissipated quickly and efficiently. It is a reliable and cost-effective thermal management solution, and its anodized surface prevents oxidation and corrosion.

The specific data is subject to PDF, and the above content is for reference