M29F200FB5AN6E2 Allicdata Electronics
Allicdata Part #:

M29F200FB5AN6E2-ND

Manufacturer Part#:

M29F200FB5AN6E2

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: IC FLASH 2M PARALLEL 48TSOP
More Detail: FLASH - NOR Memory IC 2Mb (256K x 8, 128K x 16) Pa...
DataSheet: M29F200FB5AN6E2 datasheetM29F200FB5AN6E2 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Part Status: Obsolete
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NOR
Memory Size: 2Mb (256K x 8, 128K x 16)
Write Cycle Time - Word, Page: 55ns
Access Time: 55ns
Memory Interface: Parallel
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package: 48-TSOP
Base Part Number: M29F200
Description

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Type: Memory

M29F200FB5AN6E2 Application Field and Working Principle

M29F200FB5AN6E2 is an innovative product primarily developed for use in memory technology and storage. Specifically, it is an Enhanced Double Data Rate (EDDR) storage device, which is a type of Random Access Memory (RAM) that combines the excellent fast data access capabilities of DDR RAM with advanced features such as error checking circuitry, ECC and parity bits. It is designed for various applications ranging from embedded advanced microcontroller-based devices to complex data communications systems.

The primary purpose of a memory device such as the M29F200FB5AN6E2 is to store data in digital format and make it available for processing when required. To this end, the device contains a number of memory cells, each capable of containing a single bit of data. The device is connected to the system it is providing memory for via a control bus, over which instructions and control data can be sent to the memory device.

The primary working principle of the M29F200FB5AN6E2 is based on the technique called dynamic random access memory (DRAM). As the name suggests, a dynamic memory cell is able to store one bit of data at a time, which means it can be written to, or read from, over the control bus. This technique is used to perform multiple functions such as data entry and retrieval, address comparison and control functions. In order to store large amounts of data, a number of dynamic memory cells are connected in a *chip* on the device. These are logically organized into a number of banks, each containing a number of memory cells.

The M29F200FB5AN6E2 utilizes an advanced architecture specifically designed to cope with the large amount of data stored on the device. The architecture features two major components: a data bus and an address bus. The data bus is used to transmit data between the memory device and the system it is providing memory for. The address bus is used to locate addresses associated with the memory cells. As the number of cells increases, the addressing process becomes more complex and the address bus is used to simplify the process.

One of the main advantages of the M29F200FB5AN6E2 is that it incorporates ECC and parity bit circuitry. This ensures that data integrity is maintained, even if an error occurs. An ECC is a code added to a unit of data to detect and correct errors caused by different factors such as noise, electromagnetic interference and crosstalk. A parity bit is an additional bit added to a unit of data to check whether the data is valid or not. If a discrepancy is found, it can be corrected using the parity bit.

The M29F200FB5AN6E2 is a highly versatile RAM device which is suitable for a number of different applications. It is capable of operating in a variety of applications ranging from embedded controllers to storage for sophisticated data communications systems. Furthermore, it provides excellent data integrity utilising advanced features such as ECC and parity bits.

The specific data is subject to PDF, and the above content is for reference

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