​ This article briefly introduces the types of integrated circuits ...

This article is about the packaging and pin identification of integrated circuits ...

This article is about the lassification of integrated circuits ...

This article describes the characteristics of the circular connector. ...

This article briefly introduces the register. ...

The MIC29302 is a versatile, reliable adjustable linear voltage regulator IC, with features such as short circuit protection, current limit and temp limit, suitable for a wide range of applications. ...

FPGA serial transceiver modules enable simultaneous, fast, reliable and cost-effective communication between integrated circuits. ...

This article describes the characteristics of the acceleration sensor. ...

This article describes the characteristics of the connectors. ...

This article describes the characteristics of the FPGA applications. ...

This article describes the characteristics of the PCB. ...

Global automotive semiconductor market growing rapidly due to adoption of advanced technologies and increased demand for semiconductor solutions. Industry is facing core issues such as COVID-19, rising cost, and scalability. ...

Choosing the right gate drive power converter can significantly increase the efficiency of power devices. Different types of converters are suited to different applications, so choosing the best one requires research into the options and components. ...

Multi-output DC-DC voltage converter modules convert one DC voltage into several different DC output voltages for powering multiple systems. They are found in many applications and offer over-current and over-temperature protection. ...

This article describes measurement and control FPGA ...

Embedded DSP chips offer high precision and low power consumption, making them reliable and energy-efficient for a variety of applications. ...

This article writes about the 555 timer ...

This article describes the characteristics of the sensors. ...

Mitsubishi Chemical and Dow Corning have developed new processes to improve the production yields of 300mm μ-SiC wafers, enabling the manufacture of more, smaller, and faster integrated circuits. ...

This article describes that DSP and MCU are moving toward convergence ...

This article describes the characteristics of the FPGA "programmability". ...

This article describes the characteristics of the proximity sensors. ...

This article describes the characteristics of the ERM, LRA, and piezoelectric. ...

This article writes about several chips on computer motherboard ...

The SGMII interface enables FPGA chips to have low-cost solutions with high throughput, low latency and support a variety of protocols. It is supported by major FPGA vendors and is attractive to them due to its cost effectiveness and scalability. ...

This article writes about the IO chip and clock chip on the computer motherboard ...

This article describes the characteristics of the LDC. ...

This article describes the characteristics of the interface. ...

This article write about the Intel H61 chipset series board architecture ...

This article describes the nVIDIA chipset + AMDCPU single bridge motherboard architecture. ...

This article writes about the AMD RS780 chipset motherboard architecture. ...

This article describes the characteristics of the plastic processor. ...

This article describes the characteristics of the triodes. ...

This article describes the characteristics of PIC microcontroller. ...

This article writes about the BLE microcontroller multi-sensor platform for energy harvesting ...

This article briefly introduces some common gate circuits. ...

This article describes application of the operational amplification ...

​This article writes about the role of integrated circuits ...

This article briefly introduces the features of Integrated circuit ...

This article describes the selection and use of Integrated Circuits ...