Series:	GL-N
Packaging:	Tray
Part Status:	Active
Memory Type:	Non-Volatile
Memory Format:	FLASH
Technology:	FLASH - NOR
Memory Size:	32Mb (4M x 8, 2M x 16)
Write Cycle Time - Word, Page:	90ns
Access Time:	90ns
Memory Interface:	Parallel
Voltage - Supply:	2.7 V ~ 3.6 V
Operating Temperature:	-40°C ~ 85°C (TA)
Mounting Type:	Surface Mount
Package / Case:	48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package:	48-TSOP

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S29GL032N90TFI030 Application Field and Working Principle

Introduction

S29GL032N90TFI030 is a small form factor Flash-memory device that has been employed in many embedded systems. In this article, we will explain the application field and working principle of the device.

Memory Application Fields

As a Flash-memory device, the S29GL032N90TFI030 is widely used in embedded systems. The device provides a non-volatile memory solution that can withstand challenging conditions such as high temperatures and vibration when compared to other memory technologies, making it suitable for a wide range of applications. Common applications include the following:

• Embedded applications, such as in instrumentation, medical devices, and industrial control systems
• Automotive applications, for example, in engine control units and car stereos
• Audio/visual applications, like in media players, TV set-top boxes, and digital cameras
• Consumer electronics, used in tablets, mobile phones, and personal digital assistants (PDAs)
• Network communication, used in routers and switches

Working Principle

Flash memory is a type of non-volatile memory that stores data in memory cells. When the desires of program code or data is met, electrons are attracted to the floating gate, which traps them and prevents them from flowing to other elements in the device. This is the basic mechanism for flash-memory devices to store data. Data can be written to and erased from the memory cells by applying specific voltages to the cells. Data can also be modified by partially erasing data and writing it back. For S29GL032N90TFI030 specific, the S29GL032N90TFI030 utilizes the CAN package. The CAN package is designed for the industrial operating environment by providing higher levels of chemical and thermal resistance.

Conclusion

In summary, the S29GL032N90TFI030 is a small form factor flash-memory device that provides reliable non-volatile memory solution for embedded systems. The device utilizes the CAN package and can survive harsh environment such as high temperature and vibration. These features make the device suitable for use in instrumentation, automotive, audio/visual, consumer electronics, and network communication applications.

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