APR35-35-33CB/A01

Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.366" (34.70mm)
Width:	1.366" (34.70mm)
Diameter:	--
Height Off Base (Height of Fin):	1.283" (32.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	1.90°C/W @ 200 LFM
Thermal Resistance @ Natural:	8.22°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Thermal - Heat Sinks

Thermal - Heat Sinks are commonly used in computer component to absorb and dissipate heat. The APR35-35-33CB/A01 is one of the most popular heat sinks used in consumer and industrial computers. This heat sink is capable of providing a good thermal performance as well as being small and lightweight.The APR35-35-33CB/A01 heat sink consists of aluminum fins that are perfused with copper. The fins themselves are an efficient heat dissipation surface that helps to cool various components, particularly processors. The fin’s design allows the platform to dissipate heat away from the component and spread it throughout the entire fin system, thereby increasing the heat circulation throughout the cooling system.The APR35-35-33CB/A01 heat sink has a unique design which allows the fins to have three equal widths. This feature helps to increase the airflow throughout the heat sink’s surface which helps to increase the overall efficiency of heat dissipation. The three equal fin width also helps to reduce the amount of air restrictions that occur within the cooling system. This helps to ensure that the components are kept running at their optimal temperatures.The APR35-35-33CB/A01 heat sink is designed to be compatible with a wide range of processors and motherboards. This wide compatibility helps to ensure that the heat sink can be used in virtually any computer regardless of make or model. The APR35-35-33CB/A01 is an easy-to-install component and can typically be installed without any tools or specialized knowledge.Once installed on a processor or motherboard, the APR35-35-33CB/A01 heat sink will begin to absorb all of the heat that is produced by the processor or other components. The fins will then spread this heat throughout the cooling system which will ensure that all components remain within their optimal temperature ranges. This helps to ensure that the components remain in optimum condition and helps to provide a stable and reliable computing experience.The APR35-35-33CB/A01 heat sink is a cost-effective solution for cooling various components within computer systems. Its design allows for efficient thermal performance while still being small and lightweight which helps to reduce the amount of system space taken up by the heat sink. Furthermore, the APR35-35-33CB/A01 is capable of providing a wide level of compatibility with various components, making it a popular choice for both consumers and businesses alike.

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