Allicdata Part #: | APR33-33-15CB/A01-ND |
Manufacturer Part#: |
APR33-33-15CB/A01 |
Price: | $ 4.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | APR33-33-15CB/A01 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 4.00176 |
Series: | APR |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 1.283" (32.60mm) |
Width: | 1.283" (32.60mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.575" (14.60mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 3.27°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 11.35°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat sinks are commonly seen in consumer products and industrial applications as a way to dissipate and manage heat. The APR33-33-15CB/A01 heat sink, specifically, is designed to support high-power applications, including desktop or industrial level systems. This makes it an ideal choice for those looking to keep their systems running efficiently and cooler for longer.
The APR33-33-15CB/A01 includes high-performance standard features like a wide fin area for increased heat dissipation and a machined aluminum construction, but it also has a unique combination of extra features that make it perfect for applications that need to stay cool for longer periods of time. This includes an engineered center sleeve that allows for improved airflow which allows the heat sink to handle higher wattages such as those encountered in desktop systems and industrial applications. Additionally, the APR33-33-15CB/A01 also features a specially designed air gap between the aluminum base and the fins that creates additional surface area for higher heat dissipation.
The thermal-heat sink works on the principle of transferring heat away from a source, typically a processor or system, by means of an aluminum fin and an air gap between the fin and the base. The fin acts as a conduit of heat transfer from the processor to the fins, which are connected to the base. When air passes over the fins, it is naturally cooled. As the air passes over the fins it carries the heat away from the processor, cooling it in the process. This cooling effect will allow the processor to remain cooler for longer periods of time and allow it to run more efficiently.
This type of thermal-heat sink helps to keep systems running at optimal temperatures, and prevents damaging hot-spots that can lead to systems failure. This extends the life of the system, including the processors and other components, and also keeps the system running more efficiently than other cooling solutions. The APR33-33-15CB/A01 is an ideal choice for those looking for a high-quality cooling solution that can keep their systems running at peak efficiency for extended periods.
The specific data is subject to PDF, and the above content is for reference
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