C3M0120100J Allicdata Electronics
Allicdata Part #:

C3M0120100J-ND

Manufacturer Part#:

C3M0120100J

Price: $ 6.36
Product Category:

Discrete Semiconductor Products

Manufacturer: Cree/Wolfspeed
Short Description: MOSFET N-CH 1000V 22A D2PAK-7
More Detail: N-Channel 1000V 22A (Tc) 83W (Tc) Surface Mount D2...
DataSheet: C3M0120100J datasheetC3M0120100J Datasheet/PDF
Quantity: 1000
1 +: $ 5.78340
Stock 1000Can Ship Immediately
$ 6.36
Specifications
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Package / Case: TO-263-8, D²Pak (7 Leads + Tab), TO-263CA
Supplier Device Package: D2PAK-7
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 83W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 350pF @ 600V
Vgs (Max): +15V, -4V
Gate Charge (Qg) (Max) @ Vgs: 21.5nC @ 15V
Series: C3M™
Rds On (Max) @ Id, Vgs: 155 mOhm @ 15A, 15V
Drive Voltage (Max Rds On, Min Rds On): 15V
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Drain to Source Voltage (Vdss): 1000V
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Part Status: Active
Packaging: Tube 
Description

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The C3M0120100J is a New Generation High Voltage Silicon Carbide Metal Oxide Semiconductor Field Effect Transistor (MOSFET). It is a single component, ideal for use in high frequency switching applications, high voltage supplies and rectifiers. The device has a maximum drain current rating of 10A, and a maximum drain-source voltage rating of 1200V. This makes it well-suited for use in a wide range of applications, such as motor drivers, power converters, inverters, and more.

The C3M0120100J utilizes a vertical technology MOSFET construction, which allows for improved power efficiency, reduced switching noise, and better thermal performance. This vertical design allows for the use of significantly fewer components, which reduces cost and improves reliability. Furthermore, this device also boasts a low on-resistance, which means it can handle higher currents at a lower voltage, making it well-suited for high-frequency, high-voltage applications.

The device is composed of a silicon carbide gate oxide and a gate oxide-capped tungsten gate electrode. The gate oxide is designed to provide the transistor with a low leakage current and a low gate threshold voltage, allowing the device to switch more quickly and with more efficiency. The gate oxide is also more robust than traditional silicon-based gate oxides, allowing the device to operate in harsh environments.

The C3M0120100J operates on the same principles as all other MOSFETs. It is operated by applying a voltage to the gate terminal. This creates a field, which attracts electrons from the Silicon Carbide gate oxide, resulting in a negatively charged region beneath the gate. The negatively charged region, or “depletion region”, creates a potential barrier between the drain and the source, resulting in a channel, or “transistor”, through which current can flow.

Due to its vertical construction, the C3M0120100J can be used in low gate charge and low gate resistance applications. Furthermore, the device’s high-temperature rated boards and encapsulation, as well as its low on-resistance, make it ideal for applications in high-temperature environments. Additionally, the C3M0120100J has a high breakdown voltage, a wide operating temperature range, and a low gate-to-drain capacitance, making it suitable for a wide range of applications.

In conclusion, the C3M0120100J is an ideal choice for a wide range of high-frequency and high-voltage applications. Its vertical design improves power efficiency and reduces switching noise, while its low on-resistance, wide operating temperature range, and high breakdown voltage make it suitable for a wide range of applications. With its robust construction, the C3M0120100J is well-suited for use in harsh environments.

The specific data is subject to PDF, and the above content is for reference

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