Allicdata Part #: | IRLR3103PBF-ND |
Manufacturer Part#: |
IRLR3103PBF |
Price: | $ 0.00 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | Infineon Technologies |
Short Description: | MOSFET N-CH 30V 55A DPAK |
More Detail: | N-Channel 30V 55A (Tc) 107W (Tc) Surface Mount D-P... |
DataSheet: | IRLR3103PBF Datasheet/PDF |
Quantity: | 1000 |
Series: | HEXFET® |
Packaging: | Tube |
Part Status: | Discontinued at Digi-Key |
FET Type: | N-Channel |
Technology: | MOSFET (Metal Oxide) |
Drain to Source Voltage (Vdss): | 30V |
Current - Continuous Drain (Id) @ 25°C: | 55A (Tc) |
Drive Voltage (Max Rds On, Min Rds On): | 4.5V, 10V |
Rds On (Max) @ Id, Vgs: | 19 mOhm @ 33A, 10V |
Vgs(th) (Max) @ Id: | 1V @ 250µA |
Gate Charge (Qg) (Max) @ Vgs: | 50nC @ 4.5V |
Vgs (Max): | ±16V |
Input Capacitance (Ciss) (Max) @ Vds: | 1600pF @ 25V |
FET Feature: | -- |
Power Dissipation (Max): | 107W (Tc) |
Operating Temperature: | -55°C ~ 175°C (TJ) |
Mounting Type: | Surface Mount |
Supplier Device Package: | D-Pak |
Package / Case: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
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IRLR3103PBF is a type of n-channel field effect transistor (FET). It is a single depletion-mode MOSFET designed for delivering low-voltage and high current solutions, making it suitable for a wide range of applications. It is produced with a high voltage source-drain breakdown rating and a maximum temperature of 150°C.
The IRLR3103PBF has an excellent power dissipation of 55W and it is available in a very small–signature, lead-free TO-247 package. This makes it highly suitable for any environment that requires high power efficiency and high thermal dissipation.
The basic working principle of the IRLR3103PBF is quite straightforward. It uses the unique properties of a metal-oxide-semiconductor (MOS) structure to achieve high current and low power conversion rates. The IRLR3103PBF uses two metal layers: a polysilicon layer and a silicon layer, which are placed very close together on the semiconductor wafer.
The polysilicon gate layer is used to control current flow by applying an electric field to the gate layer. This electric field is used to adjust the flow of electrons from the drain to the source. When the electric field is applied, some electrons are repelled and some are attracted; this allows for efficient control of electron flow. The voltage applied to the gate determines the current flow through the transistor; this is known as the drain-source resistance.
The other layer of the MOS structure is the silicon layer; this layer is placed on top of the polysilicon gate layer and acts as a channel through which electrons flow. This creates an ohmic contact between the source and the drain and allows for a very low resistance connection between these two. This is because the electrons are confined in the silicon channel due to the electric field applied to the gate layer.
The IRLR3103PBF also has an extremely low reverse transfer capacitance (CTR). This is a measure of the amount of charge that can be transferred across the gate layer in a very short amount of time when the electric field is reversed. This allows for very fast switching times between different power states for the device.
The IRLR3103PBF is widely used in many applications, such as electronic systems, power supplies, and electronic motor drives. It can also be used in high frequency applications, such as wireless communication systems, microwave systems, and television broadcasting. Additionally, it can also be used in other industrial applications, such as motor controllers, gate drivers, and even switch mode power supplies.
In conclusion, the IRLR3103PBF is a highly efficient and reliable FET with excellent power dissipation, reverse transfer capacitance and switching times. It is suitable for a variety of applications, from low voltage and high current solutions to high frequency applications.
The specific data is subject to PDF, and the above content is for reference
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