IXGN50N60B Allicdata Electronics
Allicdata Part #:

IXGN50N60B-ND

Manufacturer Part#:

IXGN50N60B

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: IXYS
Short Description: IGBT 75A 600V SOT-227B
More Detail: IGBT Module Single 600V 75A 300W Chassis Mount SO...
DataSheet: IXGN50N60B datasheetIXGN50N60B Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Current - Collector Cutoff (Max): 200µA
Base Part Number: IXG*50N60
Supplier Device Package: SOT-227B
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -55°C ~ 150°C (TJ)
NTC Thermistor: No
Input: Standard
Input Capacitance (Cies) @ Vce: 4.1nF @ 25V
Series: HiPerFAST™
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 50A
Power - Max: 300W
Current - Collector (Ic) (Max): 75A
Voltage - Collector Emitter Breakdown (Max): 600V
Configuration: Single
IGBT Type: --
Part Status: Obsolete
Description

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Transistors - IGBTs - Modules

The IXGN50N60B is a high-performance IGBT module produced by Infineon Technologies. An IGBT, or integrated gate bipolar transistor, combines the properties of a MOSFET (metal-oxide semiconductor field-effect transistor) and a bipolar transistor, which makes it an excellent choice for fast-switching and power-conversion applications. In this article, we’ll look at the application fields and working principles of the IXGN50N60B.

Application Fields

The IXGN50N60B is well-suited to a variety of power-control applications, including solar inverters, adjustable-speed drives, welding, UPS, induction heating and electric vehicle charging. The IXGN50N60B’s compact design, low noise operation, low losses and low EMI (electromagnetic interference) make it ideal for applications that require excellent efficiency and performance. Additionally, its outstanding current- and surge-handling capabilities make it well-suited for high-current applications.

Working Principle

The IXGN50N60B uses a vertical construction, with dielectric isolation between the collector and the power terminals. This vertical construction helps to reduce losses by increasing the module’s thermal efficiency. The gate-driver input is separate from the module, so external gate-drivers can be connected for more precise control over the module’s switching timing.

The module’s performance is further enhanced by the use of an optimized emitter structure, which minimizes the time required to turn the IGBT “on” and “off”. This results in faster switching, which reduces switching losses and helps to improve efficiency. The module is designed to operate at temperatures of up to175˚C, making it well-suited to high-temperature applications.

The IXGN50N60B also features over-current and over-temperature protection, as well as a wide range of gate-driver options for controlling and protecting the module. These features make it an excellent choice for applications that require high reliability.

Conclusion

The IXGN50N60B from Infineon Technologies is an excellent choice for power-control applications, thanks to its compact design, low noise operation, low losses and low EMI. Its optimized emitter structure reduces switching losses, while its over-current and over-temperature protection features ensure reliable operation.

The specific data is subject to PDF, and the above content is for reference

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