BSC057N08NS3GATMA1 Allicdata Electronics
Allicdata Part #:

BSC057N08NS3GATMA1TR-ND

Manufacturer Part#:

BSC057N08NS3GATMA1

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: Infineon Technologies
Short Description: MOSFET N-CH 80V 100A TDSON-8
More Detail: N-Channel 80V 16A (Ta), 100A (Tc) 2.5W (Ta), 114W ...
DataSheet: BSC057N08NS3GATMA1 datasheetBSC057N08NS3GATMA1 Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Vgs(th) (Max) @ Id: 3.5V @ 73µA
Package / Case: 8-PowerTDFN
Supplier Device Package: PG-TDSON-8
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power Dissipation (Max): 2.5W (Ta), 114W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 3900pF @ 40V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 56nC @ 10V
Series: OptiMOS™
Rds On (Max) @ Id, Vgs: 5.7 mOhm @ 50A, 10V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Current - Continuous Drain (Id) @ 25°C: 16A (Ta), 100A (Tc)
Drain to Source Voltage (Vdss): 80V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Packaging: Tape & Reel (TR) 
Description

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BSC057N08NS3GATMA1 is a trench Power MOSFET with tow source/drain terminals.

It is a high voltage MOSFET used in applications such as synchronous rectification in half-bridge converter designs. It also has applications in high power PFC circuits, and motor control circuits where high voltage capability and high performance are important. It is also suitable for high frequency switching applications.

The major specifications include a maximum drain-source voltage of 8 V, performance rating of 7.8 W, and continuous drain current of up to 350 A.

Working Principle

Under most conditions, the BSC057N08NS3GATMA1 operates in the enhancement mode. That is, the applied gate voltage turns the device “ON” and connects the channel resistance between source and drain.

The device is constructed from two distinct regions; source and drain. The base of the source and drain regions were formed by two features called the source extension and drain extension. These extensions are filled with silicon, giving them a higher resistance than the source and drain regions themselves, thus reducing the on-resistance of the device.

The region between the source and drain extensions is the channel region. It is typically composed of heavily doped n-type silicon so that it behaves as an offer resistance to the flow of electrons. This is achieved by applying a voltage to the gate terminal, which induces an electric field in the channel region, in turn inducing an electric current.

The higher the voltage applied to the gate, the more electrons are swept through the channel, thus increasing the resistance and reducing the on-state resistance of the device. In order to optimize the power dissipation on the MOSFET, it should be operated at a voltage below its maximum.

Application Field

BSC057N08NS3GATMA1 is an ideal choice for high power applications that require high voltage and high current capabilities. It is also suitable for automotive and other electrically demanding applications because of its rugged construction and optimized gate design.

It is especially suitable for heavy-duty load switching and rectification in high power junction rectifier and half-bridge applications. It is also widely used in motor control circuits, synchronous rectifier in switch mode power supplies, PFC circuits, and other high frequency digital circuit applications.

BSC057N08NS3GATMA1 offers superior thermal performance along with superior electrical characteristics such as low gate-source capacitance and low gate-drain capacitance. These characteristics make it an ideal choice for high frequency and high current applications.

The specific data is subject to PDF, and the above content is for reference

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