IRF9530NSTRRPBF

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1. Describe

The fifth-generation HEXFET® power MOSFET from the world The rectifier is realized by advanced processing technology The on-resistance per silicon area is extremely low. This benefit, Combine fast switching speed and rugged equipment The well-known design of HEXFET power MOSFET, Provide designers with extremely efficient and reliable Equipment for various applications. D2Pak is a surface mount power package that can It can accommodate chip sizes up to HEX-4. It provides the highest Power capability and any lowest possible on-resistance Existing surface mount packages. D2Pak is suitable for high Due to its low internal connection, current applications Resistance, can dissipate up to 2.0W on a typical surface Install the application. The through-hole version (IRF9530NL) can be used for low profile applications.

2. Feature

    1. Advanced process technology

    2. Surface Mount (IRF9530NS)

    3. Low profile through hole (IRF9530NL)

    4. 175°C working temperature

    5. Fast switching

    6. P channel

    7. Full avalanche rating

    8. Lead-free

3. Electrical Characteristics

4. Package overview